Vulcanization-resistant, high-thermal-conductivity and high-temperature-resistant conductive gold adhesive

A high thermal conductivity, anti-vulcanization technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., to achieve high flexibility, meet high stability, and improve heat resistance

Active Publication Date: 2020-11-13
德邦(昆山)材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to overcome the problems encountered in the prior art, and provide a kind of anti-vulcanization, high thermal conductivity, high temperature resistant conductive gold glue for LED packaging

Method used

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  • Vulcanization-resistant, high-thermal-conductivity and high-temperature-resistant conductive gold adhesive
  • Vulcanization-resistant, high-thermal-conductivity and high-temperature-resistant conductive gold adhesive
  • Vulcanization-resistant, high-thermal-conductivity and high-temperature-resistant conductive gold adhesive

Examples

Experimental program
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Effect test

preparation example Construction

[0032] Preparation of polyurethane acrylic epoxy resin:

[0033] (1) Throw 60g IPDI, 0.2g antioxidant B225 into the four-necked flask, start stirring, heat up to 50 degrees, add 0.02g catalyst T-12, start to drop 115.6 bisphenol F type epoxy acrylic resin, drop for 0.5 hours After adding, keep warm for 2.5 hours, and control the temperature between 55-65 degrees;

[0034] (2) Sampling and measuring NCO, it was reduced to 4.48%;

[0035] (3) Then heat up to 75-85 degrees, add 0.2 g of polymerization inhibitor MEHQ, 0.02 g of catalyst T-12, add dropwise HEA, finish adding dropwise in 0.5 hours, keep warm for 2.5 hours, and control the temperature between 80-90 degrees;

[0036] (4) Take a sample to measure NCO, and if it falls below 0.1%, wash the resin three times with acetone and dry it in vacuum.

[0037] Preparation of modified flake gold powder:

[0038] (1) Chlorauric acid HAuCl 4 4H 2 O was dissolved in distilled water to prepare a 20% gold solution, and the solution...

Embodiment 1

[0044] 3 parts of polyurethane modified epoxy acrylate, 8 parts of epoxy resin 830LVP, 8 parts of epoxy acrylic thinner GMA, 0.5 parts of BMI, 3 parts of DDS, 0.2 parts of Trigonox 42S, 80 parts of modified flake gold powder, KH Add 0.3 parts of -570 coupling agent into the mixing kettle, stir to control the temperature at 20-40°C, stir at a speed of 300r / min, stir for 2h, and finally vacuumize for 0.5h, and discharge for inspection.

Embodiment 2

[0046] 5 parts of polyurethane modified epoxy acrylate, 6 parts of epoxy resin 830LVP, 8 parts of epoxy acrylic diluent GMA, 0.5 parts of PMI, 3 parts of DDS, 0.2 parts of Trigonox 42S, 80 parts of modified flake gold powder, KH- Add 0.3 parts of 570 coupling agent into the mixing tank, stir to control the temperature at 20-40°C, stir at a speed of 300r / min, stir for 2h, and finally vacuumize for 0.5h, and discharge for inspection.

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Abstract

The invention relates to an anti-vulcanization, high-thermal-conductivity and high-temperature-resistant conductive gold adhesive, which comprises the following components in parts by weight: 0.5-5 parts of polyurethane modified epoxy acrylate, 5-10 parts of epoxy resin, 2-10 parts of an epoxy acrylic diluent, 0.5-5 parts of high-temperature-resistant resin, 0.1-5 parts of an epoxy curing agent, 0.05-1 part of an acrylic curing agent, 75-90 parts of modified flaky gold powder and 0.1-5 parts of an adhesive. The adopted polyurethane acrylic epoxy resin has very high flexibility and heat resistance, and the introduction of bismaleimide resin also improves the heat resistance of the conductive adhesive; due to the dual curing effects of acrylic acid and an epoxy system, the heat resistance ofepoxy, the adhesion of acrylic acid and the combinability with a base-free filler are achieved; the gold powder has vulcanization resistance, and the provided conductive adhesive can well meet the requirements of special fields on high stability of LED.

Description

technical field [0001] The invention relates to an anti-sulfurization, high thermal conductivity and high temperature resistant conductive adhesive, which belongs to the technical field of adhesives. [0002] technical background [0003] The rise of the LED industry has brought new hope to energy conservation, emission reduction, and energy environmental protection, showing an extremely broad application prospect. With the rapid development of the LED industry, especially the lighting industry, LED is gradually developing towards high power, so more and more comprehensive requirements are put forward for packaging materials. [0004] With the development of industry, the sulfur content in the air is increasing day by day, and the corrosion of various volatile sulfides and halides in the air makes the surface dark and discolored. Studies have shown that discoloration increases the surface resistance by about 20-80%, and increases power loss, which greatly reduces the stabili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J175/16C09J163/00C09J179/08C09J11/04C08G18/67
CPCC09J9/02C09J175/16C09J11/04C08G18/6705C08G18/672C08L2203/206C08L2201/08C08L2205/03C08K2201/001C08L63/00C08L79/085C08K9/04C08K7/00
Inventor 王守立陈田安王建斌解海华
Owner 德邦(昆山)材料有限公司
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