Solder wire soldering flux capable of reducing splashing and preparation method thereof

Abstract

The invention relates to a solder wire soldering flux capable of reducing splashing and a preparation method thereof. The soldering flux is composed of the following components in percentage by weightof 1.0-10.0% of compound organic acid, 0.2-5.0% of compound activator, 0.1-1.0% of compound defoamer, 2.0-10.0% of compound solvent, 0.1-1.0% of antioxidant, 0.1-1.0% of corrosion inhibitor and the balance of compound rosin. The preparation method comprises the following steps of heating, stirring and melting the compound rosin, adding the compound organic acid and the low-melting-point indissolvable activator, adding the solution dissolved with the high-melting-point dissolvable activator, the antioxidant and the corrosion inhibitor, finally adding the compound defoamer, performing continuous stirring at the constant temperature of 145-165 DEG C, performing full dissolving, and performing uniform mixing, thereby obtaining the soldering flux. The soldering flux is high in activity, easy to tin during welding, low in corrosion, small in residue and high in insulation resistance, the splashing number and the splashing distance of the soldering flux and tin beads in the welding process of a lead-free tin wire can be greatly reduced, the RoHS instruction is met, and the reliability of electronic and electrical products after welding is guaranteed.

Description

technical field [0001] The invention belongs to the technical field of electronic soldering materials, and in particular relates to a solder wire flux and a preparation method thereof. Background technique [0002] With the rapid development of electronic information products, the welding requirements for solder wire are getting higher and higher. Among them, the performance of splashing and frying tin is one of the important indicators for evaluating the quality level of a solder wire. It directly affects the quality of electronic products and will Harm to the health of welding workers. Therefore, many standards have incorporated the splash test into the testing items, such as the international standard IPC-TM-650, IPC J-STD-004B, etc. Although the national standard does not include the splash test as a testing item, most domestic manufacturers have included it Splash test is one of the important criteria for solder wire quality evaluation. [0003] In this regard, domest...

AI Technical Summary

Problems solved by technology

However, when the solder wire is soldered at high temperature, the flux will always melt and boil, decompose to generate a relatively high-pressure air pressure, and form a certain amount of high-pressure bubbles. The bursting of the bubbles will cause considerable splashes. Although the above prior art effectively reduces the Splash, but it cannot suppress the splash caused by bubble burst. In addition, fluorine-containing surfactants and ionic surfactants are used in the flux formula, which will bring certain harm to the environment and reduce the reliability of solder joints.

Images