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Flexible circuit board shaping device

A flexible circuit board and shaping device technology, which is applied in the direction of printed circuit, printed circuit manufacturing, electrical components, etc., can solve the problems of reduced production and processing efficiency of flexible circuit boards, long burrs of flexible circuit boards, etc.

Inactive Publication Date: 2020-10-23
广东勤天投资有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a flexible circuit board shaping device to solve the problem in the prior art that long burrs will be generated on the edge of the flexible circuit board due to superimposed punching. Technical Problems of Reduced Production and Processing Efficiency of Circuit Boards

Method used

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Embodiment Construction

[0029] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0030] Such as figure 1 with figure 2 As shown, the present invention provides a flexible circuit board shaping device, including a punching platform 1 with an installation opening through it, and a knife head punching drive device 101 installed on the punching platform 1, the installation opening is in the direction of its penetration A plurality of superimposed separated movable cutter heads 2 are installed at intervals, and the separated movable cutter he...

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Abstract

The invention discloses a flexible circuit board shaping device, which comprises a punching platform and a tool bit punching driving device. A plurality of separated movable tool bits which are arranged at intervals are installed on the punching platform in a stacked mode, the separated movable tool bits are installed on the punching platform through a lower female die with a female die punching opening, and the separated movable tool bits are installed in the female die punching opening with a burr grinding assembly in a sliding mode through a tool bit limiting and rebounding assembly. Transmission, limiting and resetting between the adjacent separated movable tool bits are achieved through the tool bit limiting and rebounding assembly. Each layer of base plate is punched through mutual cooperation of an independent movable cutter and a lower female die, so that the defect that burrs are long due to overlapping punching is overcome; and the burr grinding assembly in the punching opening of the female die grinds the edge of the flexible circuit board in the reset process of the separated movable tool bits, so that simplification of the production process of the flexible circuit board is facilitated, and therefore the production efficiency is further improved.

Description

technical field [0001] The invention relates to the technical field of flexible circuit board processing, in particular to a flexible circuit board shaping device. Background technique [0002] The excellent flexural resistance of flexible circuit boards is widely used in various electronic products that have relative movement between parts during operation, such as folding mobile phones, printing heads, and hard disk reading heads to provide power / signal transmission. [0003] Flexible circuit boards generally include flexible copper-clad laminates as substrates, conductive circuits and various electronic components arranged on the substrates. When producing and processing flexible circuit boards, it is necessary to divide the entire substrate into multiple flexible circuit boards. Due to the small thickness of the substrate, at present, when dividing the entire substrate, multiple small substrates are separated from the entire substrate by punching, and the entire substrat...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0014H05K3/0052H05K2203/025
Inventor 周波
Owner 广东勤天投资有限公司
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