Smart grinding and polishing machine for semiconductor materials

A semiconductor and polishing machine technology, used in grinding/polishing equipment, grinders, belt grinders, etc., can solve problems such as trouble, achieve the effect of convenient use and reduce manual operations

Pending Publication Date: 2020-01-07
DATONG XINCHENG NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] When the existing semiconductor polishing machine polishes the semiconductor, the semiconductor is generally fixed on the polishing machine. After one side is polished, the position needs to be adjusted manually, so it is troublesome to use, so we propose a semiconductor polishing machine. Material intelligent grinding and polishing machine, used to solve the problems raised above

Method used

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  • Smart grinding and polishing machine for semiconductor materials
  • Smart grinding and polishing machine for semiconductor materials
  • Smart grinding and polishing machine for semiconductor materials

Examples

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Embodiment

[0029] refer to Figure 1-6 In this embodiment, an intelligent grinding and polishing machine for semiconductor materials is proposed, including a base 1, a controller is fixedly installed on the base 1, two columns 2 are fixedly installed on the top of the base 1, and the two columns 2 are close to each other One end is rotatably connected with a card cover 3, the same semiconductor rod 5 is clamped on the two card covers 3, the same beam 4 is fixedly installed on the top of the two columns 1, and a U-shaped plate 26 is slidably connected to the beam 4. Two synchronous wheels 28 are symmetrically rotated on the inner walls of both sides of the pattern plate 26, and the same synchronous belt 29 is connected to the four synchronous wheels 28, and a polishing belt 30 is fixedly installed on the synchronous belt 29. The polishing belt 30 and the The semiconductor rods 5 are in contact.

[0030] Wherein, at first the semiconductor rod 5 is clamped on the two clamping covers 3, an...

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Abstract

The invention belongs to the field of semiconductors, and particularly relates to a smart grinding and polishing machine for semiconductor materials. In order to solve the problems that when an existing semiconductor polishing machine is used for polishing a semiconductor, the semiconductor is generally fixed on the polishing machine, and the position need to be manually adjusted after one face ofthe semiconductor is polished, the smart grinding and polishing machine is provided; the smart grinding and polishing machine includes a base, the top of the base is fixedly provided with two posts,the ends, getting close to each other, of the two posts are rotatably connected with clamping covers, one same semiconductor rod is clamped to the two clamping covers, one same beam is fixedly mountedon the top ends of the two posts, and a U-shaped plate is slidably connected to the beam. According to the machine, the semiconductor rod is clamped on the two clamping covers, then a driving motor,a polishing motor and a rotating motor are started in sequence, then comprehensive polishing of the semiconductor rod can be realized, manual adjustment of the position of the semiconductor rod is notneeded, manual operation is reduced, and the machine is very convenient to use.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to an intelligent grinding and polishing machine for semiconductor materials. Background technique [0002] A semiconductor is a material whose electrical conductivity is between that of a conductor and an insulator at room temperature. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, a diode is a device made of a semiconductor. No matter from the perspective of technology or economic development, the importance of semiconductors is enormous. [0003] When the existing semiconductor polishing machine polishes the semiconductor, the semiconductor is generally fixed on the polishing machine. After one side is polished, the position needs to be adjusted manually, so it is troublesome to use, so we propose a semiconductor polishing machine. The material intelligent grinding and polishing machine is used to solve...

Claims

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Application Information

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IPC IPC(8): B24B21/02B24B21/18
CPCB24B21/02B24B21/18
Inventor 任广慧张培林武建军柴利春王志辉张作文纪永良
Owner DATONG XINCHENG NEW MATERIAL CO LTD
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