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Efficient ceramic packaging process

A ceramic packaging and process technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve problems such as unsatisfactory and rising labor costs, and achieve the goal of improving efficiency, increasing output, and improving process integration. Effect

Pending Publication Date: 2020-10-16
WUXI ZHONGWEI GAOKE ELECTRONICS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The intelligent and highly integrated requirements of modern manufacturing can no longer meet the status quo in the way and methods of traditional manufacturing
Coupled with the rise of labor costs, the development of enterprises has brought greater pressure

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] An efficient ceramic packaging process includes the following steps:

[0054] Step a1, coating the upper surface of the steel tube shell carrier 1 with a thickness of 2 mm and applying a pyrolytic bond temporary bonding adhesive 21 with a fluidity of 100 to 300 pa·s to improve the adhesive strength. wettability and increase the bonding area to the shell carrier 1 and the ceramic shell 3;

[0055] Step b1, the ceramic shells 3 are placed on the upper surface of the shell carrier 1 in batches and arrayed with the temporary bonding glue 21 through the pyrolysis bond, so that the lateral spacing between adjacent ceramic shells 3 is equal , The longitudinal spacing is equal to form an array of ceramic shells;

[0056] Step c1: Baking the array of ceramic shells, the baking temperature is controlled at 125°C, so that the thermal bond temporary bonding glue 21 is cured, so as to increase the adhesion between the ceramic shell 3 and the shell carrier 1;

[0057] Step d1, taki...

Embodiment 2

[0062] An efficient ceramic packaging process includes the following steps:

[0063]Step a2, coating the upper surface of the glass shell carrier 1 with a light transmittance of 90% and applying a temporary bonding glue 22 for corrosion and debonding;

[0064] Step b2, the ceramic shells 3 are debonded by corrosion and the temporary bonding glue 22 is placed in batches and arrayed and pressed on the upper surface of the shell carrier 1, so that the lateral spacing between adjacent ceramic shells 3 is equal , The longitudinal spacing is equal to form an array of ceramic shells;

[0065] Step c2, irradiating the ceramic package array with UV light from the bottom of the package carrier 1 to cure the temporary bonding glue 22 for corrosion and debonding, so as to increase the bonding between the ceramic package 3 and the package carrier 1 force;

[0066] Step d2, taking the position of the ceramic package 3 as a reference to complete the mounting step of the ceramic sealing cap...

Embodiment 3

[0071] An efficient ceramic packaging process includes the following steps:

[0072] Step a3, coating the upper surface of the glass shell carrier 1 with a light transmittance of 90% and applying a temporary bonding glue 23 for laser debonding;

[0073] Step b3, the ceramic shells 3 are debonded by laser and the temporary bonding glue 23 is batched and arrayed and mounted and pressed on the upper surface of the shell carrier 1, so that the lateral distance between adjacent ceramic shells 3 is equal , The longitudinal spacing is equal to form an array of ceramic shells;

[0074] Step c3, baking the array of ceramic shells, so that the laser debonding temporary bonding glue 23 is cured, so as to increase the adhesive force between the ceramic shell 3 and the shell carrier 1;

[0075] Step d3, taking the position of the ceramic package 3 as a reference to complete the mounting step of the ceramic sealing cap 4 on the ceramic package 3 to form a ceramic package;

[0076] Step e3...

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Abstract

The invention relates to an efficient ceramic packaging process. The efficient ceramic packaging process comprises the following steps: coating the upper surface of a tube shell carrier with pyrolyticbond temporary bonding glue; mounting and pressing ceramic tube shells on the upper surface of the tube shell carrier in batches in an array manner through a pyrolytic bond temporary bonding adhesiveto form a ceramic tube shell array; baking the ceramic tube shell array, so that the pyrolytic bond temporary bonding glue is cured; mounting the ceramic sealing cap on the ceramic tube shell by taking the position of the ceramic tube shell as a reference to form a ceramic packaging body; performing heating at the bottom of the tube shell carrier, so that the adhesive force of the thermal decomposition bonding temporary bonding glue is reduced, and the de-bonding step of the ceramic packaging body and the tube shell carrier is completed; and sucking the ceramic packaging body by using a suction nozzle, so the ceramic packaging body is separated from the tube shell carrier. According to the invention, a single assembled ceramic tube shell is subjected to multi-tube combined arrangement, solarge-scale integrated machine type manufacturing is realized, the process integration degree is improved, the efficiency is improved, the output is increased, and the product yield and quality are improved.

Description

technical field [0001] The invention relates to a ceramic encapsulation process mainly applicable to similar production lines of ceramic shells and the like, in particular to a high-efficiency ceramic encapsulation process. Background technique [0002] The intelligent and highly integrated requirements of modern manufacturing can no longer meet the status quo with the methods and methods of traditional manufacturing. Coupled with rising labor costs, the development of enterprises has brought greater pressure. [0003] Under the trend of Industry 4.0, it is an urgent and necessary work to integrate traditional production and assembly processes to achieve high-speed modular production. [0004] In the digital, networked, and intelligent manufacturing requirements of future development, intelligent manufacturing must first be realized. Intelligent manufacturing requires the integration of control systems, private servers, sensors, instruments, numerical control, industrial m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/10
CPCH01L21/561H01L21/568H01L23/10
Inventor 徐罕王成迁吉勇李守委
Owner WUXI ZHONGWEI GAOKE ELECTRONICS
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