Optical device and packaging method thereof
An optical device, height-oriented technology
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[0032] It should be noted that, in the case of no conflict, the embodiments in the application and the technical features in the embodiments can be combined with each other. Undue Limitation of This Application. In the description of the embodiments of the present application, the orientations and positional relationships of "top", "bottom", "upper" and "lower" refer to the orientation and positional relationship of optical devices in normal use, for example, the attached figure 1 In the directions and positional relationships shown, "μm" refers to the SI unit of micrometer, and "mm" refers to the SI unit of millimeter. The present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0033] See Figure 1 to Figure 5 On the one hand, the embodiment of the present application provides an optical device, and the optical device includes a flexible circuit board 100 , a package 200 and a conductive connect...
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Abstract
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