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High-thermal-conductivity cured coating for aluminum-magnesium alloy back plate of LED lamp and preparation method thereof

A technology of aluminum-magnesium alloy and LED lights, which is applied in coatings, lighting and heating equipment, semiconductor devices of light-emitting elements, etc., can solve problems such as burnout, easy failure, and heat resistance, so as to ensure heat dissipation and improve heat dissipation Efficiency and the effect of improving mechanical strength

Inactive Publication Date: 2020-09-11
东莞市全印铼实业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] But it has limitations brought by the material itself: 1. The thermal conductivity is lower than that of pure aluminum, magnesium-based alloys and other materials. When applied to cold light LEDs, there is a problem of heat dissipation when the LEDs are in a high-temperature environment (because the aluminum-magnesium alloy contains Not resistant to heat, easy to fail or even burned); 2. High brittleness, poor fatigue performance, and easy to break under the action of large impact force or cyclical stress; 3. The most important heat dissipation of LED materials is through air conduction (Instead of radiation and light energy conversion in the conventional sense, because most of the radiant heat still exists in the LED element, and the same is true for light energy conversion), and the poor formability of aluminum-magnesium alloys makes it suitable for The structure of micro-fins that convect with the air is more costly
[0005] In the prior art, a heat-conducting coating is used to assist the backplane to efficiently dissipate heat, but the heat dissipation effect is very limited, and it is far from reaching the heat generation efficiency of the backplane, especially for LED lamps that are sealed and packaged, the heat dissipation is even greater. It is limited and cannot meet the heat dissipation requirements of the aluminum-magnesium alloy backplane

Method used

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  • High-thermal-conductivity cured coating for aluminum-magnesium alloy back plate of LED lamp and preparation method thereof
  • High-thermal-conductivity cured coating for aluminum-magnesium alloy back plate of LED lamp and preparation method thereof
  • High-thermal-conductivity cured coating for aluminum-magnesium alloy back plate of LED lamp and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] see figure 1 , a high thermal conductivity cured coating for an aluminum-magnesium alloy backplane of an LED lamp and a preparation method thereof, comprising a varnish component, a color ink component and a heat dissipation component, the varnish component comprising 15 parts of acrylate, 5 parts of grease, and 10 parts of urea-formaldehyde resin 5 parts, 5 parts of silicon alkyd resin and 1 part of nano-titanium dioxide, the color ink components include 0.2 parts of dispersant, 0.1 parts of leveling agent and 3 parts of carbon powder, and the heat dissipation components include 8 parts of heat-conducting monomer, 25 parts of heat-collecting microspheres and 32 parts of thermally conductive carbon fiber.

[0045] The dispersant in the color ink composition is an ionic dispersant or a polymer dispersant, and the leveling agent is a silicone leveling agent, an acrylic leveling agent or a fluorocarbon leveling agent.

[0046] The thermal conductor in the heat dissipation...

Embodiment 2

[0059] see figure 1 , a high thermal conductivity cured coating for an aluminum-magnesium alloy backplane of an LED lamp and a preparation method thereof, comprising a varnish component, a color ink component and a heat dissipation component, and the varnish component includes 18 parts of acrylate, 6 parts of grease, and 12 parts of urea-formaldehyde resin 6 parts, 6 parts of silicon alkyd resin and 3 parts of nano-titanium dioxide. The color ink components include 0.6 parts of dispersant, 0.3 parts of leveling agent and 4 parts of carbon powder. The heat dissipation components include 10 parts of heat conducting monomer, 28 parts of heat collecting microspheres and 33 parts of thermally conductive carbon fiber.

[0060] see Figure 5 A method for preparing a high thermal conductivity cured coating for an aluminum-magnesium alloy backplane of an LED lamp, comprising the following steps:

[0061] S1. Raw material preparation: prepare the corresponding varnish components, colo...

Embodiment 3

[0068] see figure 1 , a high thermal conductivity cured coating for an aluminum-magnesium alloy backplane of an LED lamp and a preparation method thereof, comprising a varnish component, a color ink component and a heat dissipation component, the varnish component including 20 parts of acrylate, 7 parts of grease, and 15 parts of urea-formaldehyde resin 1 part, 8 parts of silicon alkyd resin and 5 parts of nano-titanium dioxide, the color ink components include 1 part of dispersant, 0.5 parts of leveling agent and 5 parts of carbon powder, and the heat dissipation components include 12 parts of heat-conducting monomer, 210 parts of heat-collecting microspheres and 34 parts of thermally conductive carbon fiber.

[0069] see Figure 5 A method for preparing a high thermal conductivity cured coating for an aluminum-magnesium alloy backplane of an LED lamp, comprising the following steps:

[0070] S1. Raw material preparation: prepare the corresponding varnish components, color ...

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Abstract

The invention discloses a high-thermal-conductivity cured coating for an aluminum-magnesium alloy back plate of an LED lamp and a preparation method thereof and belongs to the field of coatings for luminescent materials. The heat conduction monomers can be doped in the coating in a large range to improve the heat dissipation effect of the coating; heat collection microspheres are embedded in the surface of the coating; meanwhile, special dispersed heat-conducting carbon fibers are directionally connected by utilizing a magnetic attraction effect; on one hand, the coating is assisted in efficient heat dissipation; the heat exchange area with the external environment is enlarged; on the other hand, the effect of accumulating heat can be achieved in a high-heat state; accumulated heat causedby insufficient heat dissipation is temporarily guided and stored in the heat collection microspheres; the heat storage capacity of the coating is utilized to make up for insufficient heat dissipationof the coating, the contact surface of the coating and the back plate is kept at a lower temperature all the time, and the heat dissipation time difference is creatively utilized to greatly improve the heat dissipation efficiency of the whole coating on the back plate, so that the heat dissipation effect of the LED lamp is effectively guaranteed.

Description

technical field [0001] The invention relates to the field of coatings for luminescent materials, more specifically, to a high thermal conductivity cured coating for an aluminum-magnesium alloy backplane of an LED lamp and a preparation method thereof. Background technique [0002] LED display is a kind of flat-panel display, which is composed of small LED module panels. It is used to display various information such as text, images, videos, and video signals. It needs a backplane to truly play a display role. In the prior art, aluminum-magnesium alloy is generally used as the LED backplane. [0003] According to the characteristics of aluminum-magnesium alloy, its advantages as LED backplane are: 1. Corrosion resistance; 2. High strength; 3. Excellent electromagnetic shielding performance; 4. Easier coloring than other aluminum-based materials; 5. Good thermal conductivity Performance; 6. Has a certain impact resistance. [0004] But it has limitations brought by the mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09D4/06C09D4/02C09D7/61F21V29/87F21Y115/10
CPCC09D4/06C09D7/61C09D7/70F21V29/87F21Y2115/10
Inventor 全振淼
Owner 东莞市全印铼实业有限公司
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