Chip and patch packaging equipment

Abstract

The invention discloses chip and patch packaging equipment. The equipment comprises a supporting stand; a penetrative inner cavity is formed in the supporting stand; an electronic device is arranged inside the penetrating inner cavity; a top packaging and clamping device is arranged between the electronic device and the upper side of the supporting stand and can realize sufficient packaging and clamping of the electronic device; and a burr grinding device is arranged at the lower side of the penetrating inner cavity and is for burr grinding of the electronic device. The equipment is simple instructure; the equipment adopts a manner which can realize high-efficiency clamping of multiple sizes of chips and patches; high-efficiency burr grinding of the chips and the patches can be conductedin a multi-angle mode; and processing precision and reliability of the equipment are improved.

Description

technical field [0001] The invention relates to the technical field of supporting equipment for chip and chip packaging, in particular to chip and chip packaging equipment. Background technique [0002] Before the chip and patch are packaged, it often involves the need to fully polish the burr of the chip and the patch. If the burr is not polished, the package will be punctured when the chip or patch is packaged and packaged, or it will be damaged during use. The existence of the above-mentioned burrs is not conducive to plastic packaging, etc., which will reduce the protection strength of chips and patches, and the existence of the above-mentioned burrs will reduce the yield rate of chips and patches in the manufacturing process, making the equipment inconvenient for efficient work and manufacturing Qualified chips and SMT products, the traditional way of grinding chips and SMTs is too single, and most of them use grinding sheets for grinding. When the patch is polished, i...

AI Technical Summary

Problems solved by technology

[0002] Before the chip and patch are packaged, it often involves the need to fully polish the burr of the chip and the patch. If the burr is not polished, the package will be punctured when the chip or patch is packaged and packaged, or it will be damaged during use. The existence of the above-mentioned burrs is not conducive to plastic packaging, etc., which will reduce the protection strength of chips and patches, and the existence of the above-mentioned burrs will reduce the yield rate of chips and patches in the manufacturing process, making the equipment inconvenient for efficient work and manufacturing Qualified chips and SMT products, the traditional way of grinding chips and SMTs is too single, and most of them use grinding sheets for grinding. When the patch is polished, it needs to be polished in all directions, but the grinding direction in the existing equipment is too single to achieve all-round grinding, which greatly reduces the working efficiency and reliability of the equipment

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