A spray type cabinet cooling system

Abstract

The invention discloses a spray type cabinet heat dissipation system. The system comprises a spraying phase change heat absorption module, a liquid storage tank, a pre-cooling module, a liquid circulating pump and insulating cooling liquid, wherein the spraying phase change heat absorption module, the liquid circulating pump, the liquid storage tank and the pre-cooling module form a phase change heat dissipation circulating loop, the insulating cooling liquid flows in the phase change heat dissipation circulating loop, and the spraying phase change heat absorption module comprises a liquid inlet pipe, a controllable spraying device, a steam condensation module, a liquid recovery module and a liquid return header pipe; the steam condensation module is positioned above a server in the cabinet and comprises a steam condensation surface, a cold source channel and a cooling chamber; functional condensation units are orthohexagnal, the centers of the functional condensation units protrude, and the peripheries of the functional condensation units are low. According to the invention, the liquid recovery efficiency is effectively improved; the controllable spraying device, the steam condensation module and the pre-cooling module are integrated in the cabinet, the structure is compact, and modular production is easy.

Description

technical field [0001] The invention relates to a cabinet heat dissipation system, in particular to a spray type cabinet heat dissipation system used in a data center. Background technique [0002] With the rapid development and in-depth integration of big data, the Internet of Things and blockchain technology, the concentration and overall scale of various types of data have increased significantly, forcing data centers to expand storage scale and improve communication and computing capabilities to meet the massive Data processing needs. However, with the adoption of a large number of rack-mounted and blade-type servers, the number of devices in a single cabinet and the heating power have increased sharply. How to solve the heat dissipation problem of electronic devices such as servers has become a key issue that needs to be solved urgently in this industry. On the other hand, with the expansion of the scale of the data center, its energy consumption is also increasing rap...

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a spray-type cabinet heat dissipation system for the shortcomings and deficiencies of the above-mentioned prior art, which uses cooling insulating liquid to spray onto the surface of the server, absorbs heat and evaporates into steam, and then condenses The heat generated inside the cabinet is discharged by means of condensation and heat release in the module to solve the heat dissipation requirements of ultra-high heat flux density electronic devices; the precise spraying device with arbitrary spraying direction and spraying flow rate is adopted to solve the problem of excessive local temperature ;Spray heat dissipation device and cooling device are integrated in the cabinet system, with compact structure and easy modular production

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