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Single-component dam material composition and preparation method thereof

A composition, one-component technology, applied in the direction of adhesive types, adhesive additives, non-polymer adhesive additives, etc., can solve the problems of colloid collapse and diffusion, and achieve easy viscosity and high aspect ratio. Effect

Active Publication Date: 2020-09-08
WUHAN CHOICE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The current dam materials generally have the problem that the glue will collapse and spread when the glue is applied and heated.

Method used

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  • Single-component dam material composition and preparation method thereof
  • Single-component dam material composition and preparation method thereof
  • Single-component dam material composition and preparation method thereof

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Embodiment Construction

[0020] The one-component dam material composition provided by the present invention includes 5-20 parts by mass of epoxy resin, 5-20 parts by mass of curing agent, 0.1-5 parts by mass of curing accelerator, and 55-90 parts by mass of inorganic filler , 0.3-10 parts by mass of fumed silica, 0.3-10 parts by mass of organically modified bentonite; as required, it may also include colorants such as carbon black. Wherein, the weight part of the curing agent is preferably 5-10, and the weight parts of the fumed silica and the organically modified bentonite are both preferably 0.3-3.

[0021] Epoxy resin is used as the main resin. Generally, one of bisphenol A epoxy resin, bisphenol F epoxy resin, biphenyl epoxy resin, aminophenol trifunctional epoxy resin, and tetrafunctional aliphatic epoxy resin can be selected. or more, preferably one or more of aminophenol trifunctional epoxy resins and tetrafunctional aliphatic epoxy resins. The chemical structural formula of aminophenol trifu...

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PUM

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Abstract

The invention discloses a single-component dam material composition and a preparation method thereof. The single-component dam material composition comprises the following components in parts by mass:5-20 parts of epoxy resin, 5-20 parts of a curing agent, 0.1-5 parts of a curing accelerator, 55-90 parts of an inorganic filler, 0.3-10 parts of fumed silica and 0.3-10 parts of organic modified bentonite, wherein the epoxy resin is one or more of aminophenol trifunctional epoxy resin or tetrafunctional aliphatic epoxy resin. According to the invention, with the combination of aminophenol trifunctional epoxy resin or tetrafunctional aliphatic epoxy resin, fumed silica and organic modified bentonite, the height-diameter ratio and thixotropy are significantly improved, the viscosity under highshearing force is maintained, the sizing is easy, and the dam material does not collapse and diffuse during sizing and heating curing.

Description

technical field [0001] The invention belongs to the field of packaging materials for semiconductor chips, and in particular relates to a single-component dam material composition and a preparation method thereof. Background technique [0002] The role of the dam is to seal the semiconductor chip with a multilayer structure manufactured by FC (Flip chip, flip chip) mounting, TSV (ThroughSilicon Via, silicon through electrode) connection, etc., on the substrate or wafer according to the relative High aspect ratio molding, dams the range that needs to be filled, effectively controls the filling range of filler flow, no underfill overflows from the substrate or wafer, and can be completely filled into the gap between components, and Can form a tough cured product with high adhesion to underfill. [0003] The current dam materials generally have the problem that the glue will collapse and spread when the glue is applied and heated. Contents of the invention [0004] The objec...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J11/04H01L23/29
CPCC09J163/00C09J11/04H01L23/293C08K13/06C08K9/04C08K3/346C08K7/00C08K7/26C08K3/04C08K3/36
Inventor 伍得廖述杭王义苏峻兴
Owner WUHAN CHOICE TECH CO LTD
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