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Flux and solder paste

A flux and solvent technology, applied in the direction of welding media, welding equipment, welding/cutting media/materials, etc., can solve problems such as ball loss, solder ball misalignment, solder solder can't be infiltrated and spread equally, and achieve low residue , The effect of suppressing the amount of residue

Active Publication Date: 2020-08-28
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In addition, in soldering using solder balls, if the wettability of the solder is not ensured, the solder will not spread evenly on the electrodes, and the position of the solder balls will be misaligned with respect to the electrodes, resulting in missing balls. subject

Method used

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  • Flux and solder paste
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0066] The fluxes of Examples and Comparative Examples were prepared with the compositions shown in Tables 1 and 2 below, and the wetting and spreading properties of solder, retention of solder balls, and amount of residue were verified. In addition, the composition rate in Table 1 and Table 2 excludes the ratio of isobornylcyclohexanol, and the whole amount of flux was set as 100 wt (weight)%.

[0067]

[0068] (1) Verification method

[0069] Print the fluxes of each embodiment and each comparative example on a Cu plate with a diameter of φ0.34mm and a thickness of t=0.2mm, and then mount Ag as 3wt%, Cu as 0.5wt%, and the remainder as a solder of Sn ( Sn-3Ag-0.5Cu) formed solder balls. The diameter of the solder ball is φ0.3 mm. The number of evaluation objects was 50 in each Example and each Comparative Example. Using a reflow oven, the N 2 Under the atmosphere, the test object prepared as above was heated from 25° C. to 250° C. at a heating rate of 5° C. / second, and ...

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Abstract

Provided is flux that can achieve a low residue so as to make it possible to ensure wetness of solder, ensure holding properties of a solder ball, and suppress the amount of residue after soldering and enable application for use without cleaning. The flux includes 1-15% by weight of an organic acid mixture comprising a C10 or higher organic acid, 50-90% by weight of iso-bornyl cyclohexanol, and 5-45% by weight of another solvent. The proportion of the iso-bornyl cyclohexanol is 50-95% by weight, where 100% by weight is the total of the iso-bornyl cyclohexanol and the other solvent. The organicacid mixture comprising the C10 or higher organic acid comprises 2-methylnonanedioic acid, 4-(methoxycarbonyl)-2,4-dimethylundecanedioic acid, 4,6-bis(methoxycarbonyl)-2,4,6-trimethyldecanedioic acid, and 8,9-bis(methoxycarbonyl)-8,9-dimethylhexadecanedioic acid.

Description

technical field [0001] The present invention relates to a flux used in soldering and a solder paste using the flux. Background technique [0002] In general, the flux used in soldering has the effect of chemically removing the metal oxide existing on the soldering material and the metal surface of the soldering object to be joined, and the metal element can be mixed between the two. Boundaries move. Therefore, by performing soldering using a flux, an intermetallic compound can be formed between the solder and the metal surface of the object to be joined, and a strong joint can be obtained. [0003] In recent years, along with the development of small information equipment, electronic components to be mounted have been rapidly reduced in size. Among electronic components, a ball grid array package (BGA) in which electrodes are arranged on the rear surface is used in order to cope with the reduction in the size of connection terminals and the reduction in mounting area due t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/363B23K35/26C22C13/00
CPCB23K35/26C22C13/00B23K35/025B23K35/362B23K35/365B23K35/262B23K35/3613
Inventor 川中子知久平冈美幸西崎贵洋川崎浩由白鸟正人
Owner SENJU METAL IND CO LTD
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