AI chip heat dissipation detection equipment based on different silicone grease smearing modes

Abstract

The invention discloses AI chip heat dissipation detection equipment based on different silicone grease smearing modes, which comprises a working box, wherein a working cavity is formed in the workingbox, and a slot block inlet is formed in a leftward opening in the left side of the working cavity. According to the invention, a chip and a radiator are placed in a main chip groove by using an adding mechanism, and a smearing mechanism can smear silicone grease with different modes or thicknesses on the upper end surface of the chip. In addition, the equipment is further provided with a wipingmechanism, that is, the smeared silicone grease can be wiped clean, and the upper end surface of the chip can be re-smeared, so that the heat dissipation performance of the chip under the condition ofanother smearing shape or thickness can be tested again, and the optimal silicone grease smearing mode or thickness can be obtained finally. The reasonable silicone grease smearing mode and thicknesscan be obtained, and the problems of insufficient heat dissipation capacity, oil seepage and the like caused by excessive or insufficient silicone grease smearing are solved.

Description

technical field [0001] The invention relates to the technical field of chip heat dissipation devices, in particular to an AI chip heat dissipation detection device based on different methods of applying silicon grease. Background technique [0002] Since the integrated circuit was invented, it has been developing rapidly, and its development speed is based on "Moore's Law"-every 18 to 24 months, the number of components and performance that an integrated circuit can accommodate will double, but the integrated circuit The energy consumption and heat dissipation of chips have increasingly become the key to restricting its development. In AI fields such as intelligent driving, AI chips are widely used. AI chips are usually larger in shape, which is similar to traditional chips in heat dissipation. Generally, air cooling is used After applying thermal conductive silicone grease on the back of the chip and installing a heat sink, it will transfer heat to the air for heat dissipat...

AI Technical Summary

Problems solved by technology

[0002] Since the integrated circuit was invented, it has been developing rapidly, and its development speed is based on "Moore's Law"-every 18 to 24 months, the number of components and performance that an integrated circuit can accommodate will double, but the integrated circuit The energy consumption and heat dissipation of chips have increasingly become the key to restricting its development. In AI fields such as intelligent driving, AI chips are widely used. AI chips are usually larger in shape, which is similar to traditional chips in heat dissipation. Generally, air cooling is used After applying thermal conductive silicone grease on the back of the chip and installing a heat sink, it will transfer heat to the air for heat dissipation. The application of thermal conductive silicone grease is very critical. Too little thermal conductive silicone grease will cause an air gap between the chip and the radiator, which is extremely difficult. The earth increases the thermal resistance, too much heat-conducting silicone grease will affect the heat conduction efficiency, and at the same time, it will cause volatilization and oil leakage. Therefore, it is necessary to carry out relevant tests on the application methods of different heat-conducting silicone greases for AI chips. Aiming at the above problems, this paper is proposed. invention

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