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High-melting-point environment-friendly superfine solder wire applied to automatic welding and preparation method thereof

An automatic welding, high melting point technology, applied in the direction of welding equipment, welding medium, welding/cutting medium/material, etc., can solve the problem of melting point of ultra-fine solder wire, etc., achieve long quality assurance period, prevent waste, and short production cycle Effect

Active Publication Date: 2020-08-28
中山翰华锡业有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem of the melting point of the existing ultra-fine solder wire, the present invention provides an environmentally friendly ultra-fine solder wire with a high melting point for automatic welding

Method used

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  • High-melting-point environment-friendly superfine solder wire applied to automatic welding and preparation method thereof
  • High-melting-point environment-friendly superfine solder wire applied to automatic welding and preparation method thereof
  • High-melting-point environment-friendly superfine solder wire applied to automatic welding and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0030] A high-melting point environment-friendly ultra-fine solder wire for automatic welding, comprising the following components by weight, 96.5% tin alloy, 3.50% flux, wherein the composition of the tin alloy is as shown in Table 2, the composition of the flux The allocation ratio is described in Table 3, and its preparation method comprises the following steps:

[0031] Weigh each component according to the weight percentages in Table 2 and Table 3, and set aside; add rosin into the reaction kettle and heat to 140°C, add solvent and thermosetting resin and stir for 30 minutes after dissolving, then add thixotropic agent and stir until completely dissolved, Lower the temperature to 70°C, add activators and surfactants and stir for 60 minutes, cool to obtain flux; melt the tin into the melting furnace and melt to 360°C, heat and stir for 20 minutes, remove the tin slag, add silver and copper , indium and stir for 20 minutes, then raise the temperature to 430°C, add cerium, van...

Embodiment 2

[0033] A high-melting point environment-friendly ultra-fine solder wire for automatic welding, comprising the following components by weight, 97.60% tin alloy, 2.40wt% soldering flux, wherein the composition of the tin alloy is as shown in Table 2, the soldering flux Component distribution is described in Table 3, and its preparation method comprises the following steps:

[0034] Weigh each component according to the weight percentages in Table 2 and Table 3, and set aside; add rosin into the reaction kettle and heat to 140°C, add solvent and thermosetting resin and stir for 30 minutes after dissolving, then add thixotropic agent and stir until completely dissolved, Lower the temperature to 70°C, add activators and surfactants and stir for 60 minutes, cool to obtain flux; melt the tin into the melting furnace and melt to 360°C, heat and stir for 20 minutes, remove the tin slag, add silver and copper , indium and stir for 20 minutes, then raise the temperature to 430°C, add cer...

Embodiment 3

[0036] A high-melting-point environmentally friendly ultra-fine solder wire for automatic welding, comprising the following components by weight, 96.1wt% tin alloy, 3.9wt% flux, wherein the composition of the tin alloy is as shown in Table 2, the flux The composition ratio is described in Table 3, and its preparation method comprises the following steps:

[0037] Weigh each component according to the weight percentages in Table 2 and Table 3, and set aside; add rosin into the reaction kettle and heat to 140°C, add solvent and thermosetting resin and stir for 30 minutes after dissolving, then add thixotropic agent and stir until completely dissolved, Lower the temperature to 80°C, add activator and surfactant and stir for 50 minutes, cool to obtain flux; melt the tin into the melting furnace and melt to 360°C, heat and stir for 10 minutes, remove the tin slag, add silver and copper , indium and stir for 20 minutes, then raise the temperature to 430°C, add cerium, vanadium, and ...

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Abstract

The invention discloses a high-melting-point environment-friendly superfine solder wire applied to automatic welding and a preparation method thereof. The high-melting-point environment-friendly superfine solder wire comprises 96.1%-98.0% of tin alloy and 2.0%-3.9% of soldering flux, wherein the tin alloy is prepared from tin, silver, copper, indium, cerium, vanadium and yttrium; the melting pointof added trace element vanadium is 1890 + / -10 DEG C, the added trace element vanadium belongs to high-melting-point rare metal, the heat resistance of the tin alloy can be enhanced, meanwhile, the abrasion resistance and bursting resistance of the solder wire are extremely good, the strength, hardness and heat resistance of the tin alloy can be obviously improved through adding yttrium, the melting point of the solder wire is increased, and meanwhile, the oxidation resistance and ductility of the tin alloy are enhanced; and the added cerium can change structure of a solder, thereby refining grains, reducing solder joint bridges, changing the surface wettability of the tin alloy, and enhancing the creep property and tensile property. The solder wire is high in melting point, excellent in tensile strength, free of lead and environmentally friendly, and when the solder wire is applied to the high-end application fields of intelligent mechanical arm welding and the like, high weldabilityand lead-free environmental protection development of products are achieved.

Description

【Technical field】 [0001] The invention belongs to the technical field of welding materials, and in particular relates to a high-melting point environment-friendly ultra-fine solder wire for automatic welding and a preparation method thereof. 【Background technique】 [0002] With the development of electronic products and their technologies, products are gradually developing in the direction of high power consumption and high power, and the requirements for ultra-fine solder wire are also getting higher and higher. The microelectronic interconnection material industry is also following the domestic electronic industry product industry. Compared with foreign products, ordinary solder wire products are not inferior to foreign products, but the melting point of ultra-fine solder wire is generally around 210°C, and it is still comparable to foreign products in high-end applications such as high-power electronic components and automatic welding. There is a considerable gap, because...

Claims

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Application Information

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IPC IPC(8): B23K35/26B23K35/36B23K35/40
CPCB23K35/262B23K35/3612B23K35/3613B23K35/40
Inventor 李爱良马鑫童桂辉王尚文王钰
Owner 中山翰华锡业有限公司
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