Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Three-dimensional conductive circuit and preparation method thereof

A conductive circuit and three-dimensional technology, which is applied in the direction of printed circuit manufacturing, printed circuit, conductive pattern formation, etc., can solve the problems of complicated process and long production cycle, and achieve the effect of simple process, low cost and high efficiency

Pending Publication Date: 2020-08-07
SHENZHEN BAROY NEW MATERIAL TECH CO LTD
View PDF5 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this method solves the problem of side etching to a large extent, this method needs to go through two steps of film attachment, exposure, and development, and the process is complicated and the production cycle is long.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Three-dimensional conductive circuit and preparation method thereof
  • Three-dimensional conductive circuit and preparation method thereof
  • Three-dimensional conductive circuit and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] A preparation method of a three-dimensional conductive circuit: as figure 1 Shown:

[0040] S1: making a groove 102 in the organic material layer 101 that conforms to the designed circuit pattern, and the depth of the groove is 1-1.25 times the height of the conductive circuit;

[0041] Groove 102 can be made groove 102 by the method of direct printing or spraying, and organic material layer 101 is the organic material layer that contains ester group and can alkali retreat, and the thermal decomposition temperature of organic material layer is lower than the heat treatment temperature of described conductive paste ;

[0042] S2: Fill the three-dimensional groove 102 with conductive paste 103, the conductive paste 103 is conductive aluminum paste, and paste the high-temperature-resistant substrate 104 on the graphics surface filled with the conductive paste 103, and the high-temperature-resistant substrate 104 is alumina ceramics , and further heat and strengthen the c...

Embodiment 2

[0046] A preparation method of a three-dimensional conductive circuit: as figure 2 Shown:

[0047] S1: Coating an organic material layer on the surface of the high-temperature-resistant substrate 201 and curing the organic material layer 202, making a groove 203 in the organic material layer 202 that conforms to the designed circuit pattern, and the depth of the groove is 1-1.25 times the height of the conductive circuit;

[0048] The groove 203 can be made by exposure and development. The organic material layer 202 is a photoresist film. The thermal decomposition temperature of the organic material layer is lower than the heat treatment temperature of the conductive paste. The high temperature resistant substrate 201 is single crystal silicon ;

[0049] S2: filling the three-dimensional groove 203 with conductive paste 204, the conductive paste 204 is conductive silver paste, curing the conductive paste to make it lose fluidity; photocuring the conductive paste;

[0050] S...

Embodiment 3

[0053] A preparation method of a three-dimensional conductive circuit: as image 3 Shown:

[0054] S1: Coating a thermal slip adhesive layer 302 on the surface of a common substrate 301, coating an organic material layer with a certain thickness on the surface of the thermal slip adhesive layer 302 and curing the organic material layer 303; the organic material layer 303 is a photoresist film, the thermal decomposition temperature of the organic material layer is lower than the heat treatment temperature of the conductive paste; the common base material 301 can be selected from epoxy resin;

[0055] S2: Make a groove 304 in the organic material layer 301 that conforms to the designed circuit pattern. The groove 304 can be made by laser or mechanical engraving. The depth of the groove is 1-1.25 times the height of the conductive circuit;

[0056] S3: Fill the three-dimensional groove with conductive paste 305, the conductive paste 305 is conductive copper paste, and paste the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a three-dimensional conductive circuit and a preparation method thereof. A designed circuit groove formed by an organic material layer is adopted, the depth of the groove is 1-1.25 times of the height of a conductive circuit, the designed circuit groove formed by the organic material layer is filled with conductive slurry, the conductive slurry is solidified, then the organic material layer is removed, and the conductive circuit is formed through heat treatment of the conductive slurry. According to the three-dimensional conductive circuit, the organic material layer isused as a groove die orifice, the depth of the groove is 1-1.25 times of the height of the conductive circuit, the groove precision is high, the shape and the circuit precision are controlled to be close to ideal design values, and the high-precision conductive circuit can be prepared.

Description

technical field [0001] The invention belongs to the technical field of conductive circuits, and in particular relates to a three-dimensional conductive circuit and a preparation method thereof. Background technique [0002] The development trend of miniaturization of electronic products promotes the development of circuit boards in a more precise direction. The transmission of electrical signals in the circuit board is mainly realized through lines, so the degree of refinement of the lines determines the miniaturization degree of the circuit board to a large extent. The methods of circuit production mainly include subtractive method, semi-additive method, and full-additive method. In the process of manufacturing circuits by the subtractive method, serious problems such as side etching and unclean etching will be caused, and thinner circuits cannot be manufactured. The semi-additive method reduces the undercut to a large extent and can be used in the production of fine line...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/10H05K3/00H05K1/09H05K1/02B22F5/00B22F3/24B22F3/22B22F3/10
CPCH05K1/0296H05K1/09H05K3/0002H05K3/10B22F3/22B22F3/10B22F3/24B22F5/00
Inventor 郭冉胡军辉李永东
Owner SHENZHEN BAROY NEW MATERIAL TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com