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Monolithic integrated image sensing chip and spectrum recognition equipment

A sensor chip, monolithic integration technology, applied in the field of imaging and spectral identification, can solve the problems of inability to achieve hyperspectral imaging, poor device performance uniformity, complex preparation process, etc., to achieve stability, reduce failure rate, reduce The effect of craft difficulty

Pending Publication Date: 2020-08-07
TSINGHUA UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the number of bands that can be measured by this technology is limited, hyperspectral imaging cannot be realized, and the preparation process is complicated, requiring multiple photolithography, etching / deposition, and there is accumulation of process errors, resulting in poor device performance uniformity and device failure.

Method used

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  • Monolithic integrated image sensing chip and spectrum recognition equipment
  • Monolithic integrated image sensing chip and spectrum recognition equipment
  • Monolithic integrated image sensing chip and spectrum recognition equipment

Examples

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Effect test

Embodiment 1

[0069] Such as Figure 2 to Figure 7 As shown, in the image sensor chip 300 provided in the first embodiment, a bare CIS wafer is used as the image sensor layer 2 to respond to visible-near infrared light. The light modulation layer 1 and the CIS wafer are both prepared by one-time tape-out using a CMOS integrated semiconductor process, and the light modulation layer 1 is directly integrated on the upper surface of the CIS wafer. Such as image 3 with Figure 5 As shown, the light modulation layer 1 described in the first embodiment includes a first sub-modulation layer 101 arranged along its thickness direction, and, as Figure 4 As shown, the light modulation layer 1 further includes a plurality of modulation units 5 distributed along the surface of the light modulation layer 1.

[0070] It is understandable that since both the light modulation layer 1 and the image sensor layer 2 can be manufactured using CMOS integrated semiconductor technology, and achieve monolithic integra...

Embodiment 2

[0086] The structure, principle, object imaging and recognition method, and chip preparation method of the image sensor chip 300 and spectrum recognition device of the second embodiment are the same as those in the foregoing embodiment and will not be repeated here. The difference is:

[0087] The light modulation layer 1 in this embodiment includes two sub-modulation layers arranged along its thickness direction and correspondingly connected, that is, as Figure 8 The first sub-modulation layer 101 and the second sub-modulation layer 102 are shown. In the two sub-modulation layers, all the modulation holes 6 of each layer are respectively arranged up and down to ensure that each modulation hole 6 of each layer can face up and down, so as to ensure that the spectral signal is transmitted vertically in the optical modulation layer 1. For smooth. All the modulation holes 6 of each layer are arranged up and down and connected and penetrate the light modulation layer 1, that is, the ...

Embodiment 3

[0090] The structure, principle, object imaging recognition method, and chip preparation method of the image sensor chip 300 and spectrum recognition device of the third embodiment are similar to those in the foregoing embodiments and will not be repeated here. The difference is:

[0091] The light modulation layer 1 described in this embodiment is Picture 9 As shown, the second sub-modulation layer 102 does not penetrate the light modulation layer 1, that is, the second sub-modulation layer 102 is the lowermost sub-modulation layer, and all the modulation holes 6 in the second sub-modulation layer 102 are It is a blind hole structure. Since the entire material of the light modulation layer 1 is made of light-transmitting material, even if all the modulation holes 6 in the second sub-modulation layer 102 are blind hole structures, it will not affect the transmission of the spectral signal.

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Abstract

The invention relates to the technical field of imaging and spectrum recognition, in particular to a monolithic integrated image sensing chip and spectrum recognition equipment. A light modulation layer of the chip is integrated on an image sensing layer; the light modulation layer comprises at least one sub-modulation layer arranged in the thickness direction of the light modulation layer; each set of pixel confirmation module comprises modulation units and induction units; at least one group of modulation units are distributed on the light modulation layer along the surface of the light modulation layer; at least one group of induction units are distributed on the image sensing layer; each group of modulation units and at least one group of induction units are correspondingly arranged along a vertical direction; a signal processing circuit layer is connected to the lower surface of the image sensing layer and is electrically connected with each sensing unit. According to the chip andthe equipment, the monolithic integration of a light splitting part and a wafer is realized; hyperspectral imaging can be realized; the failure rate of a device is favorably reduced; the yield of finished products of the device is improved; and the chip and the equipment are stable in performance and are not easily influenced by an external environment.

Description

Technical field [0001] The present invention relates to the technical field of imaging and spectrum identification, in particular to a monolithic integrated image sensor chip and spectrum identification equipment. Background technique [0002] Hyperspectral imaging technology is a technology that combines spectral detection and imaging. It can image an object under different spectra, while obtaining the geometric shape information and spectral characteristics of the detected object. Hyperspectral imaging technology has become an important means of earth observation and deep space exploration, and is widely used in agriculture, animal husbandry and forestry production, mineral resources exploration, cultural relic detection, ocean remote sensing, environmental monitoring, disaster prevention and mitigation, military reconnaissance and other fields. [0003] With the gradual miniaturization of carrying platforms, such as small satellites, drones and other small platforms, as well as ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B21/36
CPCG02B21/361
Inventor 崔开宇蔡旭升朱鸿博熊健黄翊东张巍冯雪刘仿
Owner TSINGHUA UNIV
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