Preparation method of mica paperboard

Abstract

The invention discloses a preparation method of a mica paperboard. The method comprises the steps: pretreating a mica raw material, and hydraulically stripping the pretreated mica raw material into mica flakes with three different particle sizes of -30 to +60 mesh, -60 to +80 mesh and -120 to +200 mesh; mixing the mica flakes and then mixing with a silicon resin solution prepared from organic silicon resin for pulping; in the pulping process, controlling the mixing ratio, and adding fumed silica as a pore-opening medium; and preparing thick mica paper single sheets from the slurry, laminatingthe thick mica paper single sheets, taking a fiber-reinforced silicon resin solution as an interlayer resin material, carrying out glue layer filling, adjusting the number of laminated layers of the thick mica paper single sheets, putting the thick mica paper single sheets into a hot press, and carrying out three-stage surface hot-pressing curing to obtain the finished mica paperboard. The productis good in quality, high in overall strength, not prone to interlayer stripping and high in conversion energy efficiency, and has good electrical insulation performance and heat dissipation performance.

Description

technical field [0001] The invention relates to the technical field of mica material processing, in particular to a mica cardboard method with better strength and structural stability. Background technique [0002] As a kind of naturally occurring phyllosilicate minerals, mica has excellent physical properties and electrical properties, and maintains the above properties at high temperatures. It is also completely chemically inert, resistant to high voltage, and resistant to corona discharge. and anti-radiation properties. As one of the most widely used methods of mica, mica paper itself integrates most of the excellent properties of mica, and has the advantages of non-toxic, odorless, high temperature resistance, high pressure resistance, aging resistance, corrosion resistance, and stable electrical properties. Because it has excellent high temperature resistance and insulation properties, it is used in the manufacturing process of electric heating equipment, and has excel...

AI Technical Summary

Problems solved by technology

[0003] In the field of mica paperboard processing, mica is used as the main raw material, which is broken into fine mica scales by thermochemical or hydraulic peeling, and then mica paper is made into mica paper by modern papermaking wet method, and then the mica paper is impregnated with silicone resin binder. , and dried in the dryer, cut into a certain length according to the requirements to obtain the impregnated paper, and then according to the thickness requirements of the mica board, stack a certain number of impregnated papers together and then heat-press them. This manufacturing method The prepared mica board has a layered structure, and there are defects in the type and amount of the silicone resin binder mixed between the mica scales during the drying process, and delamination and foaming are prone to occur during the hot pressing process, resulting in The quality and stability of the finished mica board are difficult to control. During the application process, the mica board has poor mechanical properties and is prone to deformation and interlayer peeling. As a result, the strength of the finished product cannot meet some jobs that require high mechanical strength and moisture resistance. environmental needs

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