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Radiator for thyristor short-time junction temperature protection and protection time acquisition method thereof

A thyristor and radiator technology, which is applied to the radiator for short-term junction temperature protection of thyristor and the acquisition of its protection time, can solve the problems of limited application of phase change materials, low thermal conductivity, large volume, etc., and can restrain the rapid growth of junction temperature. , The effect of high thermal conductivity and high thermal conductivity

Inactive Publication Date: 2020-07-24
GUANGXI UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

According to the phase change form and phase change process, it is mainly divided into gas-liquid phase change, solid-gas phase change, solid-liquid phase change, and solid-solid phase change energy storage materials. However, in the process of solid-gas phase change and gas-liquid phase change, there are Gas exists and occupies a large volume, so it is rarely used in practical applications. However, due to the low thermal conductivity of organic phase change materials, the application of phase change materials becomes very limited.

Method used

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  • Radiator for thyristor short-time junction temperature protection and protection time acquisition method thereof
  • Radiator for thyristor short-time junction temperature protection and protection time acquisition method thereof
  • Radiator for thyristor short-time junction temperature protection and protection time acquisition method thereof

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Embodiment Construction

[0038] The following will be further described in conjunction with the accompanying drawings and specific examples, so that those skilled in the art can better understand the advantages and characteristics of the present invention, so as to implement the present invention, but the examples given are not intended to limit the present invention.

[0039] In this embodiment, it is necessary to establish a reliable heat conduction channel with low thermal resistance in the phase change material matrix, reduce the temperature difference in the phase change material, and increase the thermal conductivity of the matrix. The method for increasing the thermal conductivity of the phase-change material in this embodiment is as follows: first, add metal heat-conducting fins inside the phase-change radiator, such as inserting fins, adding foam metal, and adopting a honeycomb structure. With the increase of the internal metal structure , the internal heat conduction channel of the phase chan...

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Abstract

The invention belongs to the technical field of power electronic heat dissipation, and particularly discloses a radiator for thyristor short-time junction temperature protection. The radiator is usedfor heat dissipation of a flexible direct-current transmission converter valve. The radiator comprises a phase-change material of which the heat conductivity meets a Maxwell model, a substrate, an external shell and internal fins. The phase-change material comprises a phase-change matrix and a heat conduction enhancer, wherein the external shell is fixed on the substrate to form a filling cavity.The plurality of internal fins are arranged in the external shell at intervals, and the bottom of each internal fin is connected with the substrate to divide the filling cavity into a plurality of sub-filling cavities. Each sub-filling cavity is filled with a phase change material. According to the radiator with the phase-change material, the properties that the phase-change material absorbs heatin the phase-change process and keeps the temperature unchanged are utilized; short-time junction temperature protection during thyristor overcurrent or short circuit is achieved; rising of the junction temperature is restrained; and the radiator with the phase-change material is suitable for the occasion of thyristor short circuit or overcurrent of the converter valve.

Description

technical field [0001] The invention belongs to the technical field of power electronics heat dissipation, and more specifically relates to a heat sink used for short-term junction temperature protection of thyristors and a method for obtaining protection time thereof. Background technique [0002] Since the 1990s, due to the development and application of chip integration technology and the increase in operating power, the heat flux density of electronic devices has increased more and more, and heat dissipation technology is facing great challenges. High-power thyristors are widely used in high-power power electronic devices such as flexible direct current transmission. Thyristors are components that determine the reliability of converter valve operation in DC systems. In addition to the performance of the device itself, its operating temperature is also a key factor affecting the reliability of the thyristor operation. Excessively high temperature and excessively fast tem...

Claims

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Application Information

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IPC IPC(8): H01L23/427H01L23/373H01L23/367H01L21/48
CPCH01L21/4882H01L23/367H01L23/3738H01L23/4275
Inventor 刘捷丰张镱议玉尚新
Owner GUANGXI UNIV
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