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Copper surface adhesion modifier, preparation method and application thereof

A modifier and adhesion technology, applied in the direction of adhesive additives, improvement of metal adhesion of insulating substrates, adhesives, etc.

Active Publication Date: 2021-07-06
SHENZHEN SHENGYUAN SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the problems existing in the prior art, the present invention provides a copper surface adhesion modifier, a preparation method and its application. The obtained modifier improves the adhesion of dry film, wet film, and solder resist green oil to the copper surface , has a strong binding force, no technical problems of scrapping due to thin hole copper or surface copper, and reduces the problem of copper ion pollution in wastewater

Method used

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  • Copper surface adhesion modifier, preparation method and application thereof
  • Copper surface adhesion modifier, preparation method and application thereof
  • Copper surface adhesion modifier, preparation method and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0049] Embodiment 1. A kind of preparation method of copper surface adhesion modifier

[0050] This example mainly describes a preparation method of a copper surface adhesion modifier. The formula of the copper surface adhesion modifier includes the following chemical components: bank revetment agent 5g / L, sodium hydroxide 10g / L, organic acid 20g / L, stabilizer 16g / L, accelerator 0.1g / L, wetting agent 3g / L.

[0051] The following is the preparation process of 1L copper surface adhesion modifier:

[0052] ①Put 100ml of deionized water (DI water) into a 500ml glass, weigh 10g of sodium hydroxide with an electronic scale (accurate 0.01g), then add it into the water while stirring until it is completely dissolved, then use an electronic scale (accurate 0.01g) ) After weighing 5g bank protection agent (phenylacryltriazole), add in the above-mentioned sodium hydroxide solution while stirring, until fully dissolving and clarifying;

[0053] ②Put 300ml of deionized water (DI water) ...

Embodiment 2

[0055] Example 2. Comparative experiment on the application performance of a copper surface adhesion modifier

[0056] In this example, a performance comparison experiment of the copper surface adhesion modifier described in Example 1 is mainly carried out. For this reason, the inventor has configured the microetching agent of 1L shown in Table 1, the medium roughening solution of 1L, the super-roughening solution of 1L and the copper surface adhesion modifier of 1L described in Example 1 (Example 1 Preparation), the prepared 4 sample solutions were heated to 25°C, and the control parameters of the bath solution were adjusted, as shown in Table 1.

[0057] Table 1. Configuration of microetching agent, medium roughening solution, super roughening solution and copper surface adhesion modifier

[0058]

[0059] Prepare and use four DUMMY boards (Kingboard Chemical Group Co., Ltd.) of the same specification to be scrapped with the same age (here, 6 years) and put them into dif...

Embodiment 3

[0063] Embodiment 3. A kind of preparation method of copper surface adhesion modifier

[0064] This example mainly describes a preparation method of a copper surface adhesion modifier. The formula of the copper surface adhesion modifier includes the following chemical components: bank revetment agent 4g / L, sodium hydroxide 8g / L, organic acid 15g / L, stabilizer 10g / L, accelerator 0.01g / L, wetting agent 20g / L.

[0065] The following is the preparation process of 1L copper surface adhesion modifier:

[0066] ①Put 100ml of deionized water (DI water) into a 500ml glass, weigh 8g of sodium hydroxide with an electronic scale (accurate 0.01g), then add it into the water while stirring until it is completely dissolved, then use an electronic scale (accurate 0.01g) ) After weighing 4g bank protection agent (phenylacryltriazole), add in the above-mentioned sodium hydroxide solution while stirring, until completely dissolving and clarifying;

[0067] ②Put 300ml of deionized water (DI wa...

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Abstract

The invention provides a copper surface adhesion modifier, a preparation method and its application. The raw materials for the preparation of the copper surface adhesion modifier include the following components: bank revetment agent 4~6g / L, sodium hydroxide 8~12g / L L. Organic acid 15~25g / L, stabilizer 10~40g / L, accelerator 0.01~0.15g / L, wetting agent 3~20g / L. The preparation raw materials are sequentially dissolved in deionized water according to the requirements of the preparation process to obtain the copper surface adhesion modifier of the present invention. The modifying agent described in the present invention improves the adhesion of dry film, wet film, and solder resist green oil to the copper surface, has a strong binding force, and overcomes traditional copper micro-etching and roughening, etc. The technical problem of scrapping is eliminated, and the problem of copper ion pollution in waste water is reduced.

Description

technical field [0001] The invention belongs to the technical field of circuit board processing, and in particular relates to a copper surface adhesion modifier, a preparation method and an application thereof. Background technique [0002] With the popularity of circuit boards in daily life, consumers' requirements for product performance continue to increase, which has prompted PCB circuit boards (Printed Circuit Board, printed circuit boards) and FPC circuit boards (Flexible Printed Circuit boards, flexible circuit boards) The processing technology of such precision circuit boards also needs to be continuously improved accordingly, and the standards for the precision and environmental protection of the processing technology of circuit boards are becoming more and more stringent. [0003] In the process of circuit board processing, especially the process of circuit boards, micro-etching agents, medium-roughening solutions or super-roughening solutions are usually used to m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J9/00C09J11/04C09J11/06C09J11/08H05K3/38
CPCC09J9/00C09J11/04C09J11/06C09J11/08H05K3/382
Inventor 刘德强
Owner SHENZHEN SHENGYUAN SEMICON
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