Solid-state relay power assembly and production method

Abstract

The invention discloses a solid-state relay power assembly and a production method. The power assembly comprises a DCB substrate and a power chip on the DCB substrate. Each power chip is composed of afirst chip and a second chip. The two power chips are arranged on the substrate in an inverted mode, a main electrode is led out from each power chip. The upper surfaces of the two power chips are respectively welded with a conducting strip, and the conducting strip of one power chip is connected with the corresponding electrode of the other power chip through a lead so as to realize electrical connection between the power chips. According to the solid-state relay power assembly, a chip inversion mode is adopted, the conductive copper sheet is additionally arranged, the copper sheet is weldedto the anode of the chip, the upper portion of the copper sheet is electrically connected with another chip through the binding aluminum wire, stress damage and thermal breakdown damage are effectively avoided, and the service life of the solid-state relay is prolonged.

Description

technical field [0001] The invention discloses a solid-state relay power component and a production method, and belongs to the technical field of solid-state relay manufacturing according to the International Patent Classification (IPC). Background technique [0002] Solid state relay is a kind of non-contact on-off electronic switch. Its input and output isolation device and output power switch are all composed of electronic components. , fast switching speed and other characteristics, so it has a wide application field, especially in the occasions where high current and frequent switching are required, it is the first choice of engineers. [0003] The power components of high-power solid-state relays currently on the market are divided into two structures: copper bridge welding type and chip binding type. These two structures are prone to failure after being used for a period of time in the market application process: [0004] The first power assembly structure is disclos...

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Problems solved by technology

[0003] The power components of high-power solid-state relays currently on the market are divided into two structures: copper bridge welding type and chip binding type. These two structures are prone to failure after being used for a period of time in the market application process:

[0004] The first power assembly structure is disclosed in the Chinese patent CN203481142U document, which is to form an electrical connection by welding a "several"-shaped copper bridge, such as figure 1 As shown, in the process of frequent switching of the relay, thermal expansion and contraction will occur due to the large current breaking, and the "several"-shaped conductive copper bridge a is soldered on the surface of the chip electrode (such as figure 1 Position b) produces shrinkage stress, which causes the chip surface to be strained and fails, which belongs to stress breakdown failure;

[0005] The second power component structure is to directly bind aluminum wires on the electrode surface of the chip to form an electrical connection. figure 2 The temperature at position c) will rise sharply. After the temperature of the aluminum wire rises, the bonding point on the chip surface (such as figure 2 Position d) will form a single point of heat concentration, which will easily lead to overheating breakdown at a single point on the chip surface and failure

[0006] The power components of the above two structures fail due to stress breakdown or thermal breakdown, which makes solid-state relays appear to be unreliable in many high-current application fields, which is not conducive to market promotion.

[0007] exist figure 1 , figure 2 The gate of the middle chip is led out through the bridge e, and the bridge components are small. In actual production, it is often placed manually, and the production efficiency is low.

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