Preparation method of graphene primary coated copper wire
A graphene and copper-clad technology, which is used in equipment for manufacturing conductive/semiconducting layers, cable/conductor manufacturing, electrical components, etc., and can solve problems such as secondary damage of graphene, multiple layers, and environmental pollution. , to achieve the effect of improving performance
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Embodiment 1
[0022] The present embodiment provides a kind of preparation method of graphene original coating copper wire, and concrete steps are as follows:
[0023] 1) Preparation of induced slurry: mix graphene oxide: water: additives at a ratio of 4.5%: 99: %: 0.5% and add to the homogenizer; wherein the graphene sheet diameter D90 is 1.7 μm, the thickness is 2 nm, and the specific surface area is 350 m 2 / g; the auxiliary agent is a mixed solution of polyvinylpyrrolidone and phosphate ester 1:1; the homogenizer process adopts a low-pressure homogenization pressure of 40bar and a time of 25min; a high-pressure homogenization of 900bar and a time of 35min; To wrap evenly;
[0024] 2) Reduction: The copper wire wrapped with the induced slurry is pulled to the reduction area at a low speed for drying and reduction, so that the surface of the copper wire is evenly attached to the surface of the copper wire after reduction, discontinuous, high-conductivity graphene microchips; the drying te...
Embodiment 2
[0029] The present embodiment provides a kind of preparation method of graphene original coating copper wire, and concrete steps are as follows:
[0030] 1) Preparation of induced slurry: mix graphene oxide: water: additives in a ratio of 1.5%: 99: %: 0.2% and add to a homogenizer; graphene sheet diameter D90 is 1.5 μm, thickness is 1.5 nm, and specific surface area is 380 m2 / g; the auxiliary agent is a mixed solution of sodium dodecylbenzenesulfonate and polyoxyethylene alkylphenol ether 1:1; the homogenizer process adopts a low-pressure homogenization pressure of 30bar, and a time of 20min; a high-pressure homogenization of 850bar, and a time of 30min ; After the induction slurry is prepared, the surface of the copper wire is evenly wrapped;
[0031] 2) Reduction: Pull the copper wire wrapped with the induced slurry to the reduction area at a low speed for drying and reduction, so that the surface of the copper wire is evenly attached to the reduced discontinuous, high-cond...
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