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Polyimide film and preparation method thereof

A polyimide film and polyimide technology, applied in the field of polyimide film, can solve the problem of the reduction of insulation and mechanical properties of polyimide film, potential safety hazards in the use of electronic devices, and thermal conductivity of polyimide film To improve the dispersion, increase thermal conductivity and mechanical properties, improve heat resistance and mechanical properties

Inactive Publication Date: 2020-06-09
太湖方舟新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The accumulation of heat will seriously affect the stability of electronic devices, and even bring safety hazards
[0003] However, polyimide films conventionally used as insulating substrates for electronic circuits have low thermal conductivity, and it is necessary to enhance their thermal conductivity.
At present, the thermal conductivity of polyimide film is often improved by adding thermally conductive fillers such as carbon fiber and boron nitride, but with the improvement of thermal conductivity, the insulation and mechanical properties of polyimide film will decrease, which will affect the electronic devices. Using a security risk

Method used

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  • Polyimide film and preparation method thereof

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Effect test

Embodiment 1

[0027] A kind of polyimide film, its raw material comprises: polyimide and modified carbon fiber, wherein, the content of modified carbon fiber is 20wt%;

[0028] In the preparation process of the modified carbon fiber, the carbon fiber was taken in concentrated nitric acid, ultrasonically pickled at 70°C for 4 hours, then washed with water, and dried to obtain the intermediate fiber; the intermediate fiber was evenly dispersed in the ethanol aqueous solution with a volume fraction of 90%, and the Adjust the pH to 9.5 with ammonia water, then add tetraethyl orthosilicate, stir and react at 70°C for 8 hours, then centrifuge, take the precipitate, wash it, and dry it to obtain the silica-coated carbon fiber; ultrasonically disperse the silica-coated carbon fiber at a mass fraction In a 7wt% 3-aminopropyltriethoxysilane solution, ultrasonically stir at 70°C for 2h, filter, wash the filter cake, and dry to obtain modified carbon fibers, wherein the 3-aminopropyltriethoxysilane solu...

Embodiment 2

[0031] A kind of polyimide film, its raw material comprises: polyimide and modified carbon fiber, wherein, the content of modified carbon fiber is 30wt%;

[0032] In the preparation process of the modified carbon fiber, the carbon fiber was taken in concentrated nitric acid, ultrasonically pickled at 60°C for 5 hours, then washed with water, and dried to obtain the intermediate fiber; the intermediate fiber was evenly dispersed in the ethanol aqueous solution with a volume fraction of 80%. Adjust the pH to 10 with ammonia water, then add tetraethyl orthosilicate, stir and react at 60°C for 10 hours, then centrifuge, take the precipitate, wash it, and dry it to obtain the silica-coated carbon fiber; ultrasonically disperse the silica-coated carbon fiber at a mass fraction 5wt% 3-aminopropyltriethoxysilane solution, ultrasonically stirred at 60°C for 3h, filtered, washed the filter cake, and dried to obtain modified carbon fibers, wherein the 3-aminopropyltriethoxysilane solution...

Embodiment 3

[0035] A kind of polyimide film, its raw material comprises: polyimide and modified carbon fiber, wherein, the content of modified carbon fiber is 25wt%;

[0036] During the preparation of the modified carbon fiber, the carbon fiber was ultrasonically pickled in concentrated nitric acid for 4.5 hours at 65°C, then washed with water, and dried to obtain the intermediate fiber; the intermediate fiber was uniformly dispersed in an ethanol aqueous solution with a volume fraction of 85%, Use ammonia water to adjust the pH to 9.7, then add tetraethyl orthosilicate, stir and react at 65°C for 9 hours, then centrifuge, take the precipitate, wash it, and dry it to obtain silica-coated carbon fibers; ultrasonically disperse the silica-coated carbon fibers in mass In a 3-aminopropyltriethoxysilane solution with a fraction of 6wt%, ultrasonically stir at 65°C for 2.5h, filter, wash the filter cake, and dry to obtain modified carbon fibers, wherein 3-aminopropyltriethoxy The solvent of the...

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Abstract

The invention discloses a polyimide film. The polyimide film comprises the following raw materials: polyimide and modified carbon fibers. In the preparation process of the modified carbon fibers, carbon fibers are weighed and subjected to acid pickling to obtain intermediate fibers; the intermediate fibers are uniformly dispersed in ethanol water, then a pH value is adjusted to 9.5-10 by using ammonia water, tetraethoxysilane is added, a reaction is conducted, then centrifuging is carried out, and a precipitate is taken, washed and dried to obtain silicon dioxide coated carbon fibers; and thesilicon dioxide coated carbon fibers are ultrasonically dispersed in a 3-aminopropyltriethoxysilane solution, ultrasonic stirring and filtering are carried out, and a filter cake is washed and dried to obtain the modified carbon fibers. The invention also discloses a preparation method of the polyimide film. The polyimide film has good thermal conductivity, good insulativity and high mechanical properties.

Description

technical field [0001] The invention relates to the technical field of polyimide films, in particular to a polyimide film and a preparation method thereof. Background technique [0002] Polyimide is widely used in variable frequency motors, integrated circuits, fuel cells, aerospace and other fields because of its excellent insulation properties, mechanical properties and high temperature resistance. With the rapid development of electronic information technology, the operation speed of electronic devices is getting faster and faster, and the heat emitted by them is also increasing. The accumulation of heat will seriously affect the stability of electronic devices, and even bring safety hazards. [0003] However, polyimide films conventionally used as insulating substrates for electronic circuits have low thermal conductivity, and it is necessary to enhance their thermal conductivity. At present, the thermal conductivity of polyimide film is often improved by adding therma...

Claims

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Application Information

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IPC IPC(8): C08J5/18C08L79/08C08K9/06C08K9/02C08K9/10C08K7/06C08G73/10
CPCC08J5/18C08K9/06C08K9/02C08K9/10C08K7/06C08G73/1071C08G73/105C08G73/1067C08G73/1039C08J2379/08
Inventor 方晓栋宋丽英
Owner 太湖方舟新材料科技有限公司
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