Real-time detection and monitoring system, real-time detection and monitoring method and chemical mechanical polishing equipment

Abstract

The invention provides a real-time detection and monitoring system. The real-time detection and monitoring system is used for detecting and monitoring the condition of a groove of a polishing pad in real time to manage and control the service life of the polishing pad. The real-time detection and monitoring system involves an image acquisition module, a data processing module and an interface management module. The invention further provides a real-time detection and monitoring method. The real-time detection and monitoring method comprises the steps that an image of the groove of the grindingpad is acquired in real time; and the image is analyzed in real time, whether the polishing pad reaches the service life or not is determined, and an analysis result is output in real time. The invention further provides chemical mechanical polishing equipment comprising the real-time detection and monitoring system. Image information is acquired through the image acquisition module, the image isanalyzed and processed through the data processing module, the result that whether the grinding pad reaches the service life or not is obtained in real time, and finally system control and state display are carried out through the interface management module, so that management and control of the service life of the grinding pad become timely and reliable, meanwhile, manpower is reduced, and theproblems that in the prior art, management and control over the service life of the grinding pad lacks instantaneity and reliability, and manpower is wasted are solved.

Description

technical field [0001] The invention relates to the technical field of semiconductor chips, in particular to a real-time detection system, a real-time detection method and chemical mechanical polishing equipment. Background technique [0002] Chemical Mechanical Polishing (CMP) technology has been widely used in the semiconductor chip manufacturing process. CMP is one of the most "expensive" process steps in the semiconductor manufacturing process. The reason is that the frequent use and replacement of consumables accounts for the largest share of the CMP process cost. Commonly used consumables in the CMP process include abrasive liquid, abrasive pad, abrasive pad dresser, positioning ring, etc. For the grinding pad, it will be replaced in an average of 3 to 4 days, and at the same time, the grinding pad dresser also needs to be replaced. The factor that determines whether the polishing pad should be replaced is the state of the grooves on the polishing pad. If the groove...

AI Technical Summary

Problems solved by technology

[0005] The object of the present invention is to provide a real-time detection method and system, real-time detection method and chemical mechanical polishing equipment, to solve the problems of lack of immediacy and reliability and waste of manpower in the life control of the polishing pad

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