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Method for preparing hollowed structure on surface of transparent material and in transparent material

A technology of transparent material and hollow structure, applied in the field of femtosecond laser micro-nano processing, can solve the problems of high environmental requirements and low processing efficiency, and achieve the effect of wide application prospects

Active Publication Date: 2020-05-22
JILIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The method of the present invention can realize high-efficiency and high-precision processing of various common transparent materials in a vacuum-free environment, and solves the problems of relatively high environmental requirements and low processing efficiency in the prior art

Method used

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  • Method for preparing hollowed structure on surface of transparent material and in transparent material
  • Method for preparing hollowed structure on surface of transparent material and in transparent material
  • Method for preparing hollowed structure on surface of transparent material and in transparent material

Examples

Experimental program
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Effect test

Embodiment 1

[0030] Quartz surface processing high-precision nanowire array structure

[0031] A femtosecond laser is used to write a uniform line structure inside the quartz, and then the sample is polished to the vicinity of the processing area by mechanical polishing, and then an anisotropic etching is performed by a wet etching process, so as to realize a uniform nanowire array structure on the quartz surface.

[0032] A method for preparing an ultra-high-precision structure on the surface of a transparent hard and brittle material, the specific steps are as follows:

[0033] (1), sample preparation and leveling;

[0034] First, a bulk fused silica sample with a thickness of 500 μm was cut into 20x20mm by a glass knife 2 , placed in acetone and alcohol test tubes for ultrasonic treatment for 20 minutes, and finally placed in a beaker filled with deionized water for 10 minutes, and dried with nitrogen. Then use double-sided adhesive tape to attach the quartz sample to a glass slide, a...

Embodiment 2

[0043] Nanowire Array Structure in 45-degree Direction on YAG Crystal Surface

[0044] A femtosecond laser is used to write a uniform nanometer-precision modified structure inside the YAG crystal, and an ion beam thinner is used to quantitatively thin the surface of the YAG crystal. Finally, an anisotropic etching of the YAG is performed using a wet etching process.

[0045] (1) Leveling of the sample stage:

[0046] Same as example 1.

[0047] (2) Writing of uniform nanostructures inside YAG

[0048] Same as Example 1, the only difference is that different spherical aberration correction holograms are loaded on the spatial light modulator and the single pulse energy used. The single pulse energy used here is 247nJ, and the internal depth is 30um.

[0049] (3) Focused ion beam thinning

[0050] Paste the prepared YAG sample evenly on the aluminum column of the ion beam thinning instrument with quick-drying adhesive, put the aluminum column into the ion beam thinning instru...

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Abstract

The invention discloses a method for preparing a hollowed structure on the surface of a transparent material and in the transparent material, and belongs to the technical field of femtosecond laser micro-nano machining. According to the method, the polarization and machining power is precisely controlled, a modified area with the precision of hundreds of nano is directly written in the transparentmaterial in a femtosecond laser direct writing manner, then the surface of the transparent is thinned to the machining area position (surface machining) in a mechanical / ion beam thinning manner, finally the material is etched through a wet etching process, and preparation of the hollowed structure with high precision, any patterned structure and the precision of hundreds of nano is achieved. According to the method, efficient high-precision machining of multiple common transparent materials can be achieved in a vacuum environment, and the problems that in the prior art, the requirement for the environment is high, and the machining efficiency is low are solved.

Description

technical field [0001] The invention belongs to the technical field of femtosecond laser micro-nano processing, and specifically relates to using a femtosecond laser to directly write a uniform line structure with a precision of 100 nanometers inside a transparent material. Through subsequent polishing and wet etching processes, the surface and interior ultrahigh Processing accuracy and the preparation of hollow structures with arbitrary depth-to-diameter ratios. Background technique [0002] With the continuous advancement of science and technology, people have higher and higher requirements for integration and miniaturization. Compared with large-scale devices with the same function, devices prepared using micro-nano structures not only have low energy consumption, high efficiency, and high sensitivity. Advantages, and at the same time, due to its small size, it is convenient for multi-functional integration. The same is true for optics. In recent years, the preparation ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/0622B23K26/352B23K26/70B08B3/02B08B3/08B24B1/00
CPCB08B3/02B08B3/08B23K26/362B24B1/00B23K26/0622B23K26/352B23K26/702
Inventor 孙洪波樊华陈岐岱
Owner JILIN UNIV
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