Preparation method of silica gel pad

Abstract

The invention relates to the technical field of preparation of silica gel materials, in particular to a preparation method of a silica gel pad. The fumed silica used in the invention has a foaming effect, and the benzene ring structure also endows the matrix resin with heat resistance and rigidity, so that the epoxy group and the hydroxyl group enable the material to have reactive adhesive force;meanwhile, in the heating reaction process, dehydration condensation of a plurality of hydroxyl groups enables the crosslinking density to be increased; when the circuit board works under a high-temperature condition, the matrix resin is difficult to pyrolyze due to high crosslinking density; the concentration change of effective adhesion components in the matrix resin is small, so that the stronger adhesive force is maintained; by foaming the copolymer by using fumed silica, the resin foam being loose and porous is prepared, wherein the graphite powder in the resin foam expands at a high temperature and adheres to the inner surfaces of the micropores, so that the heat conduction area of the silica gel pad is increased through the loosed and expanded graphite powder; in addition, heat is rapidly dissipated through the micropores, the heat conduction performance of the silica gel pad is improved, and the silica gel pad has wide application prospects.

Description

technical field [0001] The invention relates to the technical field of silica gel material preparation, in particular to a preparation method of a silica gel pad. Background technique [0002] Silica gel pad is a heat-conducting medium material synthesized by a special process with silica gel as the base material, adding various auxiliary materials such as metal oxides. In the industry, it is also known as heat-conducting silicone pad, soft heat-conducting pad, etc., which are specially designed for the use of gaps to transfer heat. It can fill the gaps and complete the heat transfer between the heating part and the cooling part. The function of shock absorption and sealing can meet the design requirements of equipment miniaturization and ultra-thinning. It is extremely manufacturable and usable, and has a wide range of thickness. It is an excellent thermal conductivity filling material. [0003] At present, the traditional silicone pads on the market are generally made of ...

AI Technical Summary

Problems solved by technology

[0004] At present, the silica gel pads in the prior art often have the following defects: (1) low thermal conductivity, generally no more than 1.5W / m·k, mainly due to the influence of contact density and thermal conductivity of thermally conductive fillers; (2) flow Poor performance, due to the addition of a large proportion of fillers, the viscosity of the system is greatly increased, resulting in poor fluidity; (3) low heat resistance, generally can not work for a long time above 150 ° C, the main reason is the heat resistance of silicone oil Insufficient resistance, and poor compatibility with fillers; (4) Poor stretch resistance and low voltage resistance, it is easy to tear due to poor stretch resistance during use; (5) Thermal expansion coefficient Larger, it will cause greater pressure on the components of the electronic components, resulting in deformation and damage to the components; (6) The curing speed is slow, and it needs to be heated and cured at a higher temperature for a longer time, and vulcanization needs to be added during the curing process of the material It is easy to cause serious pollution to the environment, which is not conducive to environmental protection and human health.

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