fpc bending forming device and fpc bending forming equipment

Abstract

The invention discloses an FPC bending and forming device, which includes a pressing module, a forming module, a forming part, and a bearing table. The pressing module includes a middle plate, a pressing plate and a guide assembly, and the forming module includes a pressure head, The slider and the stopper, the forming part includes the body part and the forming part, the bearing table includes the bearing part and the step part; the vertical downward linear movement of the pressure plate drives the pressure head to press and position the FPC on the bearing part and drives the forming part to press down. The right FPC is on the step part, and the stopper pushes the forming part of the molded part fixed with the slider to slide toward the wedge-shaped structure of the step part through the vertical downward linear movement of the middle plate, so that the FPC is bent to form a wedge-shaped structure. The bent shape with the same shape and structure makes the bent FPC just reach the required angle after rebounding, ensuring that it meets the installation requirements; the invention also provides a FPC bending forming equipment, which simplifies the FPC bending process and improves the bending efficiency. High efficiency, high precision, convenient operation, simple structure, greatly improving production efficiency.

Description

technical field [0001] The invention relates to the field of electronic equipment, in particular to a device for FPC bending and forming. Background technique [0002] Flexible printed circuit board, referred to as FPC, is a highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability, and has many advantages that rigid printed circuit boards do not have. FPC can be bent, wound, and folded freely, and can be arranged arbitrarily according to the requirements of space layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. [0003] Flexible circuit board products generally need to be assembled by bending. For some mobile terminals, such as mobile phones, due to their small internal space, the flexible circuit board is req...

AI Technical Summary

Problems solved by technology

[0003] Flexible circuit board products generally need to be assembled by bending. For some mobile terminals, such as mobile phones, due to their small internal space, the flexible circuit board is required to be bent to a greater degree. Therefore, in the assembly process, the flexible circuit board needs to be Perform pre-bending treatment; in the prior art, due to the large difference in manual operation, it will lead to problems such as inconsistent bending effect of FPC, low bending efficiency and high scrap rate. Using equipment instead of manual operation can improve production efficiency, but the existing The FPC after being bent by advanced bending equipment has a tendency to bounce back to its original state, resulting in the resilience of the FPC bending area so that the bent FPC will rebound and cannot reach the required angle

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