Through hole electroplating method of printed circuit board

A technology for printed circuit board and through-hole electroplating, applied in the field of printed circuit boards, can solve problems such as unfavorable human health, and achieve the effects of fast electron migration, improved electroplating efficiency, and good specific surface area

Active Publication Date: 2020-03-27
UNIV OF ELECTRONICS SCI & TECH OF CHINA +1
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However, it uses highly toxic organic solvents such ...

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  • Through hole electroplating method of printed circuit board
  • Through hole electroplating method of printed circuit board
  • Through hole electroplating method of printed circuit board

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[0049] The principles and features of the present invention are described below in conjunction with the accompanying drawings, and the examples given are only used to explain the present invention, and are not intended to limit the scope of the present invention.

[0050] Such as Figure 1-6 As shown, a method for through-hole plating of a printed circuit board provided in an embodiment of the present invention includes the following steps:

[0051] Step 1: Make graphene oxide graft γ-aminoethylaminopropyltrimethoxysilane to obtain product A, such as figure 1 shown, where figure 1 In (a), the left side is the structural formula of graphene oxide, and the right side is the structural formula of γ-aminoethylaminopropyltrimethoxysilane, figure 1 (b) is the structural formula of the product A after grafting;

[0052] Dissolve 50mg of γ-aminoethylaminopropyltrimethoxysilane and 100mg of graphene oxide in 100mL of ethanol solution, then stir and react at 65°C at 100rpm for 10h, t...

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Abstract

The invention relates to a through hole electroplating method of a printed circuit board. The method comprises the following steps that graphene oxide is grafted to gamma-aminoethyl aminopropyl trimethoxy silane, and a product A is obtained; the product A adsorbs active metal ions to obtain a product B; the product B is physically adsorbed to the surface of an insulating substrate on the wall of athrough hole of the printed circuit board to form an adsorption layer; the adsorption layer is converted into an electric conduction layer through the chemical reduction process; and the wall of thethrough hole with the electric conduction layer is electroplated to form a metal layer. Graphene oxide is selected to be grafted to gamma-aminoethyl aminopropyl trimethoxy silane, due to the fact thathigh-density oxide bond functional sites are formed on the grating interface, and adsorption capacity to the active metal ions is effectively improved; and meanwhile, ethidene diamine perssads on thesurface of the electric conduction layer can effectively improve the capturing capacity to copper ions in a solution in the electroplating process, the mass transfer function of the copper ions is accelerated, accelerated deposition of a copper plated layer in the hole is facilitated, and therefore the uniform plating capacity of the plating solution is greatly enhanced.

Description

technical field [0001] The invention belongs to the field of printed circuit boards, and in particular relates to a through-hole electroplating method for printed circuit boards. Background technique [0002] After the printed circuit board is drilled, hole metallization is required to achieve interconnection between layers. Hole metallization consists of two steps, first forming a conductive layer on the hole wall, and then thickening it by electroplating. Graphene is a two-dimensional material with ultrahigh electrical conductivity. At present, the industry has begun to try to use graphene as a conductive layer in the metallization process. [0003] However, if the conductive layer does not contain metal or metal particles, it is difficult to directly deposit the coating on the non-metallic conductive layer. Usually, it is necessary to use the original metal as the starting point for lateral growth, but the uniformity of the thickness of the coating formed in this way P...

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Application Information

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IPC IPC(8): C25D7/04C25D5/56C25D5/18C25D3/38
CPCC25D3/38C25D5/18C25D5/56C25D7/04
Inventor 陈苑明王英杰李清华何为王翀王守绪周国云王青云艾克华胡志强
Owner UNIV OF ELECTRONICS SCI & TECH OF CHINA
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