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Wafer processing equipment, wafer processing method and application thereof

A technology of processing equipment and processing methods, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as residues in the edge area of ​​​​the back of the wafer, avoid falling and debris, reduce maintenance time, and improve utilization. Effect

Pending Publication Date: 2020-03-10
CHANGXIN MEMORY TECH INC
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Problems solved by technology

[0006] In view of the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a wafer processing equipment, a wafer processing method and its application, which are used to solve the problems caused by the residual pollutants in the edge region of the back of the wafer in the prior art. A series of quality problems

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  • Wafer processing equipment, wafer processing method and application thereof
  • Wafer processing equipment, wafer processing method and application thereof
  • Wafer processing equipment, wafer processing method and application thereof

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Embodiment Construction

[0073] The implementation of the present invention will be illustrated by specific specific examples below, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0074] see Figure 4 to Figure 10 . It should be noted that the structures, proportions, sizes, etc. shown in the drawings attached to this specification are only used to match the content disclosed in the specification, for those who are familiar with this technology to understand and read, and are not used to limit the implementation of the present invention. Limiting conditions, so there is no technical substantive meaning, any modification of structure, change of proportional relationship or adjustment of size, without affecting the effect and purpose of the present invention, should still fall within the scope of the present invention. The disclosed technical content must be within the scope covered. At the s...

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Abstract

The invention provides wafer processing equipment, a wafer processing method and application thereof. The wafer processing equipment comprises a workbench and a back grinding module, wherein the workbench is used for adsorbing a wafer, and the wafer is provided with a wafer back edge area protruding out of the workbench; the back grinding module is located below the wafer, makes contact with the wafer back edge area and is used for grinding the wafer back edge area. Pollutants on the back surface of the wafer are removed by utilizing the back grinding module, the cleanliness and the flatness of the back surface of the wafer are improved, the pollution of pollutants on the back surface of the wafer to equipment and the falling of the wafer in the transmission process and the alarm of the equipment in the manufacturing process due to the unevenness of the back surface of the wafer caused by the pollutants are avoided, the maintenance time of the equipment is reduced, and the utilizationrate of the equipment is improved; the risk that pollutants on the back surface of the wafer are broken and fall off in the subsequent technological process of the wafer is reduced, and the product yield is increased.

Description

technical field [0001] The invention belongs to the field of semiconductor integrated circuits, and relates to wafer processing equipment, a wafer processing method and applications thereof. Background technique [0002] In the field of semiconductor integrated circuits, circuit patterns in semiconductor integrated circuits are usually prepared by photolithography. Photolithography has always been considered the most critical step in integrated circuit manufacturing. Use has an important impact on the quality of the product. [0003] The photolithography process is a complicated process, and its essence is to copy the circuit pattern in the form of graphics to the semiconductor substrate to be etched or ion-implanted later. The general photolithography process mainly includes the following steps: Dielectric film layer (conductor film or semiconductor film), and then use photoresist coating equipment to coat (Coating) photoresist on the wafer, and irradiate light on the phot...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/304H01L21/02H01L21/027
CPCH01L21/02057H01L21/02096H01L21/0274H01L21/304H01L21/67051H01L21/67092
Inventor 吴明锋
Owner CHANGXIN MEMORY TECH INC
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