Composite board

A composite board and substrate technology, applied in the field of composite boards, can solve the problems of reduced structural strength, easy breakage, heavy board weight, etc., to improve tensile strength and flexural strength, avoid warping or normal deformation, The effect of improving the pressure bearing capacity

Pending Publication Date: 2020-03-06
SHANGHAI XINGYE MATERIALS TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, inorganic plates also have other problems, such as high material density, heavy board weight, micropores in the overall structure, lack of toughness, easy to break when affected by impact stress and shear stress, and low structural strength Moreover, the nail holding power is poor, and the single-quality board is prone to warping and deformation after being placed for a long time, and the production cost is high.
Furthermore, the magnesium oxychloride cement used in the glass magnesium slab is corrosive to reinforcing materials such as steel, and the brittleness will gradually increase after long-term use, and the structural strength will decrease

Method used

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Embodiment Construction

[0039]In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the following will clearly and completely describe the technical solutions of the embodiments of the present invention in conjunction with the drawings of the embodiments of the present invention. Apparently, the described embodiments are some, not all, embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative effort fall within the protection scope of the present invention.

[0040] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the patent application specification and claims of the present invention do not indicate any order, quantity or impor...

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Abstract

The invention discloses a composite board. The composite board comprises a first board, a second board and a plurality of beams connected with the first board and the second board; the first board andthe second board are boards with corresponding characteristics respectively, and each comprise a base board, a stretching resistance layer and a compression resistance layer; the first board and thesecond board are oppositely arranged, the outer surface of the first board and the outer surface of the second board are parallelly arranged at the preset distance, and the stretching resistance layerof the first board and the stretching resistance layer of the second board are the same in preset stretching prestress. The composite board provided by the invention can be used for wall surface panel or decorative panel for a building module, and boards for other purposes.

Description

technical field [0001] The application relates to a composite board, especially a composite board with cement as the main material. Background technique [0002] With the continuous development of the construction industry and the continuous updating and transformation of building materials, the production methods of buildings are also undergoing great changes. Today, new buildings are moving towards assembly and modularization. However, the structural panels used in building modularization have limited the progress of building modularization due to their single variety, substandard performance, and unqualified fire prevention and waterproofing. [0003] At present, the common structural panels on the market are roughly divided into organic panels and inorganic panels. [0004] Organic boards include traditional wood fiber boards, particle boards, OSB boards, wood fiber boards, etc. Most of these organic boards are flammable, have poor fire performance, and have the probl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04C2/284E04C2/30E04B1/66E04B1/88E04B1/90
CPCE04B1/66E04B1/88E04B1/90E04C2/284E04C2/30
Inventor 高峰陈艳凤刘在祥蔡园丰朱涛牛争艳王兵盛浩
Owner SHANGHAI XINGYE MATERIALS TECH CO LTD
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