A UV nanosecond laser direct writing microfluidic chip preparation system and method

A microfluidic chip and laser direct writing technology, which is applied in laser welding equipment, chemical instruments and methods, manufacturing tools, etc., can solve the problems of lack of flexibility in processing methods, achieve simple and controllable operation and debugging, reduce oxidation, and convert easily feasible effect

Active Publication Date: 2022-04-26
广州市凯佳光学科技有限公司
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Problems solved by technology

This technology still has technical barriers to the application of ultraviolet laser and laser cutting head processing, and the processing method lacks flexibility for processing large-scale structures

Method used

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  • A UV nanosecond laser direct writing microfluidic chip preparation system and method
  • A UV nanosecond laser direct writing microfluidic chip preparation system and method
  • A UV nanosecond laser direct writing microfluidic chip preparation system and method

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Embodiment Construction

[0046] In order to make the technical means, creative features, goals and effects of the present invention easy to understand, the present invention will be further elaborated below in conjunction with specific illustrations. In the description of the present invention, it should be noted that unless otherwise specified and Limitation, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, it can also be a detachable connection, or an integral connection can be a mechanical connection or an electrical connection; it can be It can be directly connected, or indirectly connected through an intermediary, and can be connected internally between two components.

[0047] Such as figure 1 , figure 2 , Figure 4 As shown, a system for preparing a microfluidic chip by direct writing of an ultraviolet nanosecond laser includes: an ultraviolet nanosecond laser 1, an electronically controlled aperture 2 i...

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Abstract

The invention relates to a preparation system and method for an ultraviolet nanosecond laser direct writing microfluidic chip. The microfluidic chip preparation system includes: an ultraviolet nanosecond laser, an electronically controlled aperture, a laser beam expander, a beam converter, and a beam Rotator, lens, dichroic mirror, laser cutting head, three-dimensional mobile platform and control device. The invention adopts a beam converter composed of a binary phase plate and an axicon lens, which can effectively generate smooth and high-quality first-class zero-order and long-Rayleigh The length of the Bessel laser can effectively erase the first-order aperture outside the zero-order light in the center of the zero-order Bessel beam, thereby effectively improving the processing quality of the Bessel beam. The invention can realize laser direct writing microfluidic chip processing with high aspect ratio, improve laser processing efficiency, and has simple system structure and easy operation, and can be used for high-efficiency and high-quality processing of microfluidic chips in various schemes.

Description

technical field [0001] The invention relates to the technical field of laser preparation, in particular to a preparation system and method for an ultraviolet nanosecond laser direct writing microfluidic chip. Background technique [0002] As one of the main means of micro-nano manufacturing, laser micro-nano processing technology has the characteristics of non-contact, low pollution and high processing precision. Laser direct writing processing is to focus the laser beam and directly expose it on the surface of the material to form a microstructure. Compared with infrared and visible light band lasers, ultraviolet lasers have lower thermal effects. With the rapid development of the ultraviolet pulse laser industry in recent years, the increase in laser power and the reduction in product prices make them more suitable for the industrialization of laser micro-nano processing systems. Successful applications have widely covered many fields such as microelectronics, materials s...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/364B23K26/382B23K26/70B01L3/00
CPCB01L3/502707B23K26/364B23K26/382B23K26/702
Inventor 温维佳娄凯
Owner 广州市凯佳光学科技有限公司
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