A kind of dismantling and debonding method of sapphire wafer and metal parts

A technology for sapphire wafers and metal parts, which is applied in the field of disassembly and degumming of sapphire wafers and metal parts, can solve problems such as inability to use Haval glue to disassemble and degumming, and achieves a solution that reduces the risk of falling off, improves work efficiency, and has high drying efficiency. Effect

Active Publication Date: 2022-03-01
LENS TECH CHANGSHA
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  • Claims
  • Application Information

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Problems solved by technology

Since the technical background of the patent does not require the connection between the metal part and the glass part to be particularly stable and long-lasting, it requires that the two can repeat the process of fast bonding and degumming many times, focusing on efficiency and pollution-free; and for this In terms of invention, it is completely impossible to use foamed anaerobic adhesives in the camera processing process, and its degumming method cannot be applied to the disassembly and degumming of Haval glue, so this patent cannot solve the above-mentioned technical problems

Method used

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  • A kind of dismantling and debonding method of sapphire wafer and metal parts

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Embodiment 1

[0028] A dismantling and debonding method of a sapphire wafer and a metal part, comprising the steps of:

[0029] Step 1): Place the camera product to be reworked on the special graphite fixture of the hot bending machine, keep the flow rate of nitrogen gas at 130±0.5L / min, and heat at 350°C for 30min to make the Haval glue layer occur Carbonization, at this time, a gap is formed between the sapphire wafer and the metal part.

[0030] Step 2): Soak the camera that has completed step 1) in a container filled with degumming potion, so that the carbonized adhesive layer and ink fall off or dissolve in the degumming potion. The temperature of the degumming potion is 70°C and the degumming time is 60 minutes. , Cooperate with ultrasonic synchronization when degumming.

[0031] Step 3): Place the metal parts that have completed step 2) on the Teflon fixture and put them into a single-slot ultrasonic cleaning basket, add pure water with a resistance of not less than 15MΩ and keep th...

Embodiment 2

[0035] The difference from Example 1 is that the degumming solution used is the PA-3302 type degumming solution purchased from Hunan Lier Electronic Materials Co., Ltd., its pH value is 7 and the specific components include 20% methyl ethyl alcohol base ketone, 10% xylene, 10% N,N-dimethylformamide, 5% acetone and 55% ethanol.

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Abstract

The invention provides a dismantling and degumming method of a sapphire wafer and a metal part. Firstly, the bonding assembly of the two is placed in a vacuum or a protective gas environment and heated to 320-380°C, and used for bonding after 20-40 minutes The Haval glue layer is carbonized, and a gap is formed between the sapphire wafer and the metal part, and then the carbonized glue layer and ink on the surface of the sapphire wafer and the metal part are removed with a 65-75°C degumming potion. The degumming potion is not strongly corrosive and cooperates with ultrasonic Use, and finally use ultrasonic waves to clean the metal parts in pure water at 60-70°C and dry them in three stages with hot filtered air in a tunnel drying furnace to completely remove surface impurities. The method has simple and practical steps, short time consumption, fast dismantling speed, good degumming effect, reduces the risk of peeling off of the coating layer, and avoids discoloration and yellowing of metal parts.

Description

technical field [0001] The invention relates to the technical field of sapphire camera processing, in particular to a method for disassembling and degumming sapphire wafers and metal parts. Background technique [0002] The main component of sapphire is aluminum oxide (Al 2 o 3 ), because of its high hardness, high melting point, good light transmission, excellent electrical insulation, stable chemical properties, etc., it is widely used in high-tech fields such as machinery, optics, and information. Among them, the application of sapphire chips in the field of cameras most widely. The camera is mainly composed of a chip and a metal ring bonded and assembled by Haval glue (main components include nitrile rubber, phenolic resin, etc.) The material has an elliptical structure and its two ends are hollowed out to form a symmetrical double-circle camera hole with a certain radius. Some areas on the metal ring are electroplated with special coatings and films. [0003] Limite...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03B17/02
CPCG03B17/02
Inventor 周群飞钟耀辉胡智敏
Owner LENS TECH CHANGSHA
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