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Automatic sheet arranging machine for packaging sheet materials

A technology of packaging chips and automatic discharge, which is applied in the direction of conveyor objects, transportation and packaging, electrical components, etc., can solve the problems of restricting the processing efficiency of semiconductor electrical components, affecting the automatic chip discharge machine, and the mutual extrusion of package chips. Achieve the effect of reducing the manual participation rate, smooth nesting, and ensuring the correct swing direction

Pending Publication Date: 2019-12-24
广东协铖微电子科技有限公司
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AI Technical Summary

Problems solved by technology

[0003] However, in the existing automatic chip arranging machine, the packaging chip is manually moved from the previous process to the chip arranging machine, and then the chip is arranged. The degree of automation is not high, which restricts the processing efficiency of semiconductor electrical components.
Even if there is a conveying device with the previous process, it is a simple conveyor belt. During the conveying process, it is easy to cause the packaging chips to squeeze each other on the conveyor belt, which will affect the discharge of the automatic chip discharger.

Method used

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  • Automatic sheet arranging machine for packaging sheet materials
  • Automatic sheet arranging machine for packaging sheet materials
  • Automatic sheet arranging machine for packaging sheet materials

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Embodiment Construction

[0025] In the following, the present invention will be further described in conjunction with the accompanying drawings and specific embodiments, so as to understand more clearly the technical idea claimed in the present invention. It is only stated here that the words for directions such as up, down, left, right, front, back, inside, and outside that appear or will appear in the text of the present invention are only based on the accompanying drawings of the present invention, and are not specific to the present invention. limited.

[0026] like Figure 1-3 As shown, an automatic chip unloading machine for packaged sheets 1 in the embodiment of the present invention includes a workbench 3, a clamping chassis 4 placed on the workbench 3, and is used to cooperate with the clamping chassis 4 to place the packaged pieces The clamping top frame 5 clamped by the material 1 and the material shifting device 6 for moving the packaging sheets 1 to the corresponding positions of the cla...

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Abstract

The invention relates to the field of semiconductor processing equipment, in particular to an automatic sheet arrangement machine for packaging sheet materials, which comprises a controller, a workbench, a clamping bottom frame, a clamping top frame, a material moving device and a conveying device. The conveying device comprises a fixing support, a conveying belt, a material supporting belt, a blocking mechanism, a first photoelectric switch and a second photoelectric switch. According to the conveying device of the automatic sheet arranging machine, through mutual cooperation of the conveyingbelt, the material supporting belt and the controller, packaging sheet materials in the previous procedure can be moved to a feeding area of the material moving device instead of manual work, and themanual participation rate is reduced; and meanwhile, under the action of the blocking air cylinder, the first photoelectric switch and the second photoelectric switch, the subsequently-entering packaging sheet materials are prevented from entering a feeding area of the conveying device to be mutually extruded with the previous packaging sheet material, and smooth discharging of the automatic sheet arranging machine is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to an automatic chip arranging machine for packaging chips. Background technique [0002] With the development of microelectronics technology, the processing equipment of semiconductor electrical components is gradually developing towards automation. In the automatic packaging machine for packaging chips, the material transfer device sends the packaging chips to the corresponding position on the clamping chassis of the workbench. , and then the clamping top frame cooperates with the clamping bottom frame to clamp the packaging sheet and move the packaging sheet to the plastic sealing machine for plastic sealing. [0003] However, in the existing automatic chip arranging machine, the packaging chip material is manually moved from the previous process to the chip arranging machine for chip arranging. The degree of automation is not high, which restricts the processing...

Claims

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Application Information

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IPC IPC(8): H01L21/67H01L21/677H01L21/683
CPCH01L21/67703H01L21/67253H01L21/67294H01L21/67242H01L21/6838
Inventor 赖小军肖涛梁胜陆梓钊黄伟杰
Owner 广东协铖微电子科技有限公司
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