Automatic sheet arranging machine for packaging sheet materials

Abstract

The invention relates to the field of semiconductor processing equipment, in particular to an automatic sheet arrangement machine for packaging sheet materials, which comprises a controller, a workbench, a clamping bottom frame, a clamping top frame, a material moving device and a conveying device. The conveying device comprises a fixing support, a conveying belt, a material supporting belt, a blocking mechanism, a first photoelectric switch and a second photoelectric switch. According to the conveying device of the automatic sheet arranging machine, through mutual cooperation of the conveyingbelt, the material supporting belt and the controller, packaging sheet materials in the previous procedure can be moved to a feeding area of the material moving device instead of manual work, and themanual participation rate is reduced; and meanwhile, under the action of the blocking air cylinder, the first photoelectric switch and the second photoelectric switch, the subsequently-entering packaging sheet materials are prevented from entering a feeding area of the conveying device to be mutually extruded with the previous packaging sheet material, and smooth discharging of the automatic sheet arranging machine is guaranteed.

Description

technical field [0001] The invention relates to the field of semiconductor processing equipment, in particular to an automatic chip arranging machine for packaging chips. Background technique [0002] With the development of microelectronics technology, the processing equipment of semiconductor electrical components is gradually developing towards automation. In the automatic packaging machine for packaging chips, the material transfer device sends the packaging chips to the corresponding position on the clamping chassis of the workbench. , and then the clamping top frame cooperates with the clamping bottom frame to clamp the packaging sheet and move the packaging sheet to the plastic sealing machine for plastic sealing. [0003] However, in the existing automatic chip arranging machine, the packaging chip material is manually moved from the previous process to the chip arranging machine for chip arranging. The degree of automation is not high, which restricts the processing...

AI Technical Summary

Problems solved by technology

[0003] However, in the existing automatic chip arranging machine, the packaging chip is manually moved from the previous process to the chip arranging machine, and then the chip is arranged. The degree of automation is not high, which restricts the processing efficiency of semiconductor electrical components.

Even if there is a conveying device with the previous process, it is a simple conveyor belt. During the conveying process, it is easy to cause the packaging chips to squeeze each other on the conveyor belt, which will affect the discharge of the automatic chip discharger.

Images