Flexible automatic wire connection device and method

Abstract

The invention discloses a flexible automatic wire connection device and method. The flexible automatic wire connection device comprises a supporting stand column, rotary plate-shaped flexible gripperassemblies perpendicular to the axial direction of the supporting stand column are symmetrically arranged at the upper end and the lower end of the supporting stand column; a turning table is arrangedat the bottom of the supporting stand column; and the flexible gripper assemblies are provided with a plurality of flexible grippers for flexible wire connection of semiconductor material filaments.According to the flexible automatic wire connection device, the flexible wire connection of the optical fiber class semiconductor material filaments is realized, the flexible automatic wire connectiondevice can be used for holding and connecting high-grade optical fiber class filaments, and can also be used for holding and connecting other high-grade hard material filaments; and the flexible automatic wire connection device protects the surfaces and the cross sections of the filaments to the greatest extent in the process of wire connection, each flexible gripping unit is connected to only one filament at one time, friction contact between the filaments is avoided, and thus the surface integrity and the dimension accuracy of the filaments in the wire connection process are ensured.

Description

technical field [0001] The invention relates to the technical field of flexible clamping auxiliary tooling, in particular to a flexible automatic wire splicing device and a wire splicing method, which are mainly used for flexible automatic splicing of semiconductor material filaments. Background technique [0002] In the process of processing semiconductor rods such as optical fibers into bio-photoconductive identification chip materials, it is necessary to draw larger-diameter semiconductor rods (about 400 mm in diameter) into filaments of different diameters (diameter 400 mm) through a wire drawing machine. 0.3mm-4.3mm), and then cut it into a specific length by a wire cutter. The cut filaments enter the splicing device, that is, the cut filaments fall into the splicing device. This operation is called the splicing process. During the wire splicing process, it is not only necessary to ensure that the filaments can fall into the wire splicing device accurately and reliably...

AI Technical Summary

Problems solved by technology

Since the wire splicing barrel is a hard material, when the filament falls into the barrel, it will inevitably contact and collide with the inner wall of the barrel, which will inevitably cause damage to the surface of the filament or unnecessary dimensional deformation

At the same time, a splicing barrel of the device often needs to connect multiple filaments, and friction and collision between filaments will inevitably occur during the splicing process, thereby affecting the surface integrity and size of the optical fiber filaments. Therefore, it is not suitable for splicing of semiconductor materials such as high-grade optical fibers.

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