Single-component anaerobic silicon slice bottom plate adhesive and preparation method thereof

An anaerobic silicon, one-component technology, used in chemical instruments and methods, adhesives, adhesive types, etc., can solve problems such as long bonding preparation time, difficulty in improving production efficiency, and inability to meet customers' 30min degumming time. , to speed up the production rhythm, reduce manpower and material resources, and improve the effect of reactivity

Active Publication Date: 2019-11-12
广西珀源新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The traditional bonding auxiliary material uses two-component epoxy glue. Before use, the two groups of A and B need to be weighed and mixed together and stirred evenly before the glue can be applied and bonded. The bonding preparation time is long, and the initial curing time is 8 -10 minutes, it is difficult to improve production efficiency, it is difficult to adapt to the high-speed flow of the current cutting process, and it is difficult to adapt to the industry trend of high-efficiency diamond wire cutting
One-component glue and two-component glue have higher bonding efficiency, but the current one-component glue on the market cannot meet the customer's 30min degumming time at 90°C

Method used

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  • Single-component anaerobic silicon slice bottom plate adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] A kind of one-component anaerobic silicon slice floor glue, wherein, comprise the raw material of following weight portion: take gram as unit, wherein:

[0039] Hydroxypropyl methacrylate 50, difunctional urethane acrylate 30, polymerization inhibitor p-hydroxyanisole 0.05, accelerator saccharin 1, complexing agent edetate disodium 0.02 and initiator cumene hydroperoxide 1. Methylpropylene glycol 1, polyethylene glycol (200) dimethacrylate 1 and microsphere blowing agent 1.

[0040] The preparation method of the one-component anaerobic silicon slice bottom plate adhesive is as follows: wipe the stirring tank clean to ensure that there are no impurities that affect the reaction; start the stirring tank, and turn on the temperature control device to control the temperature at 30°C, and add methacrylic acid to the reaction tank Hydroxypropyl ester, difunctional urethane acrylic resin, methyl propylene glycol, polyethylene glycol (200) dimethacrylate were stirred for 60 min...

Embodiment 2

[0042] A kind of one-component anaerobic silicon slice floor glue, wherein, comprise the raw material of following weight portion: take gram as unit, wherein:

[0043] Hydroxypropyl methacrylate 55, difunctional urethane acrylate 40, polymerization inhibitor p-hydroxyanisole 0.08, accelerator saccharin 1.5, complexing agent edetate disodium 0.06, initiator cumene hydroperoxide 3. Methylpropylene glycol 2, polyethylene glycol (200) dimethacrylate 2 and microsphere foaming agent 3.

[0044] The preparation method of the one-component anaerobic silicon slice bottom plate adhesive is as follows: wipe the stirring tank clean to ensure that there are no impurities that affect the reaction; start the stirring tank, and turn on the temperature control device to control the temperature at 30°C, and add methacrylic acid to the reaction tank Hydroxypropyl ester, difunctional urethane acrylic resin, methyl propylene glycol, polyethylene glycol (200) dimethacrylate were stirred for 60 minu...

Embodiment 3

[0046] A kind of one-component anaerobic silicon slice floor glue, wherein, comprise the raw material of following weight portion: take gram as unit, wherein:

[0047] Hydroxypropyl methacrylate 60, difunctional urethane acrylate 50, polymerization inhibitor p-hydroxyanisole 0.1, accelerator saccharin 2, complexing agent edetate disodium 0.1 and initiator cumene hydroperoxide 5. Methylpropylene glycol 3, polyethylene glycol (200) dimethacrylate 3 and microsphere blowing agent 5.

[0048]The preparation method of the one-component anaerobic silicon slice bottom plate adhesive is as follows: wipe the stirring tank clean to ensure that there are no impurities that affect the reaction; start the stirring tank, and turn on the temperature control device to control the temperature at 30°C, and add methacrylic acid to the reaction tank Hydroxypropyl ester, difunctional urethane acrylic resin, methyl propylene glycol, polyethylene glycol (200) dimethacrylate were stirred for 60 minute...

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Abstract

The invention discloses a single-component anaerobic silicon slice bottom plate adhesive. The single-component anaerobic silicon slice bottom plate adhesive is prepared from the following raw materials in parts by weight: 50-60 parts of hydroxypropyl methacrylate, 30-50 parts of polyurethane acrylate, 0.05-0.1 part of polymerization inhibitor,1-2 parts of accelerators,0.02-0.1 part of complexing agents and 1-5 parts of initiators, and the single-component anaerobic silicon slice bottom plate adhesive is further prepared from 1-3 parts of methyl propylene glycol, 1-3 parts of polyethylene glycol dimethacrylate and 1-5 parts of foaming agents. According to the single-component anaerobic silicon slice bottom plate adhesive, compared with a conventional two-component glue plate adhesive, the adhesive mixing time is not required, the initial curing time is about 40s, the adhesive being arranged well is only required, rapid degumming can be achieved especially at 90 DEG C, convenience and fastness are achieved, manpower and material resources are saved, the production rhythm is greatly accelerated, and the rapid and high-efficiency industry development requirement is met.

Description

technical field [0001] The invention relates to the technical field of diamond wire cutting silicon chip adhesive in the photovoltaic industry, more specifically, the invention relates to a single-component anaerobic silicon slice bottom plate adhesive and a preparation method thereof. Background technique [0002] Solar silicon wafer cutting is an important link in the manufacture of photovoltaic solar cells. How to improve the cutting efficiency of the cutting process and reduce unnecessary time waste is the focus of the company's attention, and the length of time for bonding auxiliary materials directly affects the work efficiency of the entire cutting process. [0003] The traditional bonding auxiliary material uses two-component epoxy glue. Before use, the two groups of A and B need to be weighed and mixed together and stirred evenly before the glue can be applied and bonded. The bonding preparation time is long, and the initial curing time is 8 -10 minutes, it is diffi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/06B01F7/18C08J9/32
CPCC09J175/14C09J11/06C08J9/32C08J2375/14C08J2203/22B01F27/90C08K5/053C08K5/103
Inventor 潘方立伍世钰高满苏光临陈韬
Owner 广西珀源新材料有限公司
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