High-precision eutectic welding equipment capable of maintaining constant pressing force

Abstract

The invention discloses high-precision eutectic welding equipment capable of maintaining constant pressing force. The equipment comprises a eutectic welding table which supports and fixes a workpieceA, an XY-axis driving unit driving the eutectic welding table to move in a horizontal plane, a Z-axis driving unit is driving the eutectic welding table to carry out fine adjustment on the Z axis, a pressing head assembly rotatably arranged on a first support and pressing a workpiece B, a pressure sensor assembly which is rotatably arranged on a second support and applies pressure to the pressinghead assembly, and a servo driving part which drives the pressure sensor assembly to rotate, the pressure sensor assembly is in closed-loop control with the Z-axis driving unit, and when pressure dataof the pressure sensor assembly is smaller than a set value, the Z-axis driving unit drives the eutectic welding table to move upwards until the data acquired by the pressure sensor assembly is in aset range. According to the equipment, the pressing force between eutectic welding core wire pieces can be effectively guaranteed to be constant, and the welding quality is improved.

Description

【Technical field】 [0001] The invention belongs to the technical field of eutectic welding, in particular to a high-precision eutectic welding equipment capable of maintaining a constant pressing force. 【Background technique】 [0002] Eutectic welding is also called low melting point alloy welding. Its basic characteristic is that two different metals can form alloys in a certain weight ratio at temperatures far below their respective melting points. The most common one is gold-silicon eutectic soldering. Gold has a melting point of 1063 degrees Celsius, while silicon has a melting point of 1414 degrees Celsius. If the silicon gold ratio of 2.85% and 97.15% is combined, a eutectic alloy body with a melting point of 363 degrees Celsius can be formed. This is the theoretical basis of gold-silicon eutectic welding. Gold-silicon eutectic soldering is usually used for soldering circuit boards. Many electronic components are sensitive to temperature, and with the gradual miniat...

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Problems solved by technology

[0003] During the soldering process, since the solder plating layer on the surface of the bottom sheet will change in volume as the temperature changes, from solid to liquid, during this process, a slight misalignment must occur between the two chips. If this dislocation is not corrected or avoided during the welding process, it will seriously affect the final welding quality and cause bad

[0004] During eutectic soldering, two chips need to be attached to each other. Since there are many circuit designs in the chip, the position accuracy requirements of the attachment are very high. In the prior art, such as CN201210179151.9 discloses an LED chip Eutectic welding equipment, which cannot guarantee the stability of the positions of the two components to be welded during the welding process

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