Thin film packaging structure, device packaging method and application

Abstract

The invention relates to a thin film packaging structure, a device packaging method and an application. The thin film packaging structure includes an inorganic packaging layer, an organic packaging layer, and a barrier layer. The method of combining the organic packaging layer and the inorganic packaging layer by attaching and hot pressing can replace a traditional method for manufacturing the organic packaging layer by inkjet printing, not only avoid various defects caused by abnormal inkjet and improves the process stability and the product yield of film packaging, but also saves consumables, reduce equipment, process and raw material costs. In addition, because there is no need to consider the wettability between the organic ink and the inorganic packaging layer, multiple organic packaging materials can be selected, for example, a material with a better water-oxygen barrier effect and lower cost can be selected to improve product performance and further reduce costs.

Description

technical field [0001] The invention relates to the technical field of device packaging, in particular to a thin film packaging structure, a device packaging method and its application. Background technique [0002] Thin film encapsulation (TFE) is a packaging technology suitable for narrow frame and flexible OLED panels. A typical thin film encapsulation structure consists of overlapping and repeated layers of inorganic materials and organic materials. Wherein, the inorganic material layer is a water-oxygen barrier layer, and its main function is to block water and oxygen. The organic material layer is a planarization layer, and its main function is to cover the defects on the surface of the inorganic material layer (including particle protrusions, pin holes, etc.), provide a flat surface for subsequent film formation, and reduce the size of the inorganic material layer. The stress on the surface of the layer prevents the propagation of defects. The organic material layer...

AI Technical Summary

Problems solved by technology

[0003] The organic material layer is deposited by inkjet printing, and the wetting between the ink of the organic material and the inorganic material layer will directly affect the quality of the film, which largely limits the choice of thin film packaging materials.

In addition, inkjet printing has great uncertainty in the process. Nozzle clogging, satellite ink droplets, ink droplet volume changes, etc. may affect the printing accuracy, and even cause defects such as chromatic aberration (mura) and pinholes, which affect the film quality. Package Appearance and Package Performance

At the same time, after inkjet printing, UV curing is required to form the organic material layer. Excessive UV irradiation may affect the efficiency and life of the luminescent material.

In addition, inkjet printing equipment and related consumables are expensive, especially the print head, resulting in high cost of thin film packaging

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