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Electrolytic silver plating solution

An electroplating solution and electrolytic silver technology, applied in the field of electrolytic silver electroplating solution, can solve the problems of silver electroplating film gloss, reflectance surface roughness, gloss effect, etc., achieve high reflectivity, reduce cost, and improve manufacturing yield Effect

Active Publication Date: 2019-10-29
ELECTROPLATING ENGINEERS OF JAPAN LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in these prior art, the glossiness and reflectivity of the silver electroplating film are greatly affected by the surface roughness and glossiness of the substrate before electroplating.

Method used

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  • Electrolytic silver plating solution
  • Electrolytic silver plating solution
  • Electrolytic silver plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～12、 comparative example 1～5

[0056] As the object to be plated, use 0.1dm 2 copper plate. First, it is neutralized with dilute sulfuric acid after degreasing treatment with an alkaline degreasing liquid. Thereafter, about 1 μm matte copper plating was performed by means of a cyanide bath. Thereafter, about 0.1 μm silver plating was performed by a cyanide-based high-current rapid bath (striker bath).

[0057] The plating solutions of Examples 1-12 and Comparative Examples 1-5 were prepared with the compositions described in Tables 1 and 2. The object to be plated was immersed in 1 L of the prepared plating solution, and electrolytic silver plating was performed under the conditions described in Tables 1 and 2 until the thickness of the silver film became 4 μm, washed with clean pure water, and then dried. In addition, the density|concentration of the selenium compound in Table 1 is an amount converted into selenium.

[0058] Gloss and reflectance were measured for the silver coatings of Examples 1 to 1...

Embodiment 13～24、 comparative example 7～11

[0065] (Examples 13-24, Comparative Examples 7-11, Reference Examples 1-2)

[0066] As the object to be plated, use 0.1dm 2 copper plate. First, after degreasing treatment with an alkaline degreasing liquid, it is neutralized with dilute sulfuric acid. Thereafter, about 1 μm matte copper plating was performed by means of a cyanide bath. Thereafter, approximately 0.1 μm silver plating was performed by a cyanide-based high-current rapid bath.

[0067] The electroplating solutions of Examples 13-24, Comparative Examples 7-11, and Reference Examples 1-2 were prepared with the compositions described in Tables 3 and 4. The object to be plated was immersed in 1 L of the prepared plating solution, electrolytic silver plating was performed under the conditions described in Tables 3 and 4 until the thickness of the silver film became 20 μm, washed with clean pure water, and dried.

[0068] The hardness was measured about the silver coating films of Examples 13-24, Comparative Exampl...

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PUM

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Abstract

According to the present invention, the present invention provides an electrolytic silver plating solution containing a silver cyanide complex, an electrically conductive salt, a selenium compound, asaturated fatty acid, and / or a salt thereof, and capable of forming a silver film with a high gloss and a high reflectance.

Description

technical field [0001] The present invention relates to electrolytic silver plating solutions. Specifically, it relates to an electrolytic silver plating solution using a cyanide as a silver source, which can obtain a plated film with high gloss and high reflectance. Furthermore, the present invention relates to an electrolytic silver plating solution using a cyanide compound as a silver source to obtain a plated film having high hardness. Background technique [0002] Because of its white luster, silver has been used in jewelry since ancient times. Silver is produced in a relatively large amount among precious metals and is the cheapest. Therefore, silver plating is also carried out in modern times for decorative purposes such as silver jewelry or tableware. In addition, since silver has the highest conductivity among metals at room temperature, silver plating is also widely used for lead frames and substrates for electronic devices such as ICs and transistors. Furthermo...

Claims

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Application Information

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IPC IPC(8): C25D3/46C25D3/64
CPCC25D3/46C25D3/64
Inventor 井关柾登
Owner ELECTROPLATING ENGINEERS OF JAPAN LTD
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