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Metallized film and manufacturing method thereof

A technology of metallized film and manufacturing method, applied in chemical instruments and methods, metal pattern materials, metal layered products, etc., can solve problems such as poor productivity, and achieve the effects of smooth conduction loss and stable passability

Active Publication Date: 2021-12-14
TORAY KP FILMS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the thin metal film used as the power supply part of electrolytic plating in the semi-additive method, it is necessary to have a copper film thickness of about 0.1 to 2.0 μm. When the film is formed only by the sputtering method, the productivity is poor.

Method used

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  • Metallized film and manufacturing method thereof
  • Metallized film and manufacturing method thereof
  • Metallized film and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment

[0046] Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited to these Examples.

Embodiment approach 1

[0048] A plating resist is formed on the copper film 2 of the metallized film of the present invention. As a plating resist, "PMER P-LA900PM" of Tokyo Ohka Co., Ltd. was used, and a plating resist having a wiring pattern of L / S=10 / 10 μm was formed with a resist thickness of 20 μm. The electrolytic Cu plating solution was set to copper sulfate pentahydrate 50g / L, sulfuric acid 200g / L, chlorine 50ppm, additives of Meltex Co., Ltd. "Copper Gleam" ST-901A 2ml / L, "Copper Gleam" ST-901B 20ml / L liquid. In terms of electroplating conditions, by jet flow, 1.0A / dm 2 The current density is such that the thickness of the copper film 3 is 10 µm thick. After electrolytic plating, the plating resist is removed with an alkaline stripper, and then the copper film 1 and copper film 2 for power supply between the wirings are removed using a hydrogen peroxide-sulfuric acid-based etching solution to form wirings.

[0049] It should be noted that, in the case of using a metallized film formed w...

Embodiment approach 2

[0052] Using the same electrolytic plating solution as in Embodiment 1 for wiring formation, the plating conditions were jet flow, 1.0A / dm 2 A current density of 15 μm thick copper film 3 was formed on the entire surface of the copper film 2 of the metallized film of the fluororesin film.

[0053] Next, an etching resist is formed on the above-mentioned copper film 3 . As a plating resist, Tokyo Ohka Co., Ltd. "PMER P-LA900PM" was used, and the etching resist which formed the wiring pattern of L / S=50 / 50 micrometer with a resist thickness of 20 micrometers was used. After the plating resist was formed, the copper film 1, the copper film 2, and the copper film 3 were etched by a shower method using a ferric chloride-based etching solution. After etching, the etching resist is removed with an alkaline stripper to form wiring.

[0054] (Measurement of Surface Roughness)

[0055] The surface roughness Ra is the arithmetic mean roughness defined in JIS B 0601-1994, which is the f...

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Abstract

The present invention forms a smooth thin-film copper film on a smooth fluororesin by using a physical vapor deposition method, and appropriately selects the type of the physical vapor deposition method to provide a device that ensures adhesion strength between the fluororesin and the copper film and can form wiring. Metallized film. By controlling the thickness of the metal film formed by sputtering to a minimum and combining it with a vacuum evaporation method, it is possible to provide a metallized film capable of electrolytic plating, stable in adhesion strength, and capable of forming wiring.

Description

technical field [0001] The present invention relates to a metallized film that can be suitably used for wiring board applications having signal wiring suitable for transmitting high-frequency digital signals, and a method for producing the same. Background technique [0002] In recent years, mobile communication devices are increasingly required to perform large-capacity signal processing in order to achieve high-speed networks and the like. Therefore, in order to process such a large-capacity signal, a printed wiring board capable of handling high-speed signals is required. Since high-speed signals are high-frequency electrical signals, printed wiring boards used in these electronic devices are required to be able to suppress transmission loss when used in a high-frequency region. When the frequency of the electric signal is increased to 1 GHz or higher, the influence of the skin effect in which the current flows only on the surface of the conductor becomes significant, an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/20B32B15/082C23C14/02C23C14/06C23C14/14C23C28/02C25D5/56C25D7/00H05K1/03
CPCB32B15/082H05K1/03C23C14/02C23C14/06C23C14/14C23C14/20C23C28/02C25D5/56C25D7/00C23C14/16C23C14/025C23C14/022H05K1/09
Inventor 藤信男都地辉明
Owner TORAY KP FILMS
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