Spraying cavity and steam cavity integrated phase change cooling device and system

Abstract

The invention discloses a spraying cavity and steam cavity integrated phase change cooling device and system. The device comprises cavities, a spraying cavity liquid inlet pipe, a spraying cavity liquid outlet pipe, a spraying hole plate and array nozzles, wherein the spraying hole plate and the array nozzles are located in the cavity. The cavities comprise a spraying cavity and a steam cavity; the spraying hole plate divides the spraying cavity into a buffer chamber and a spraying chamber; the spraying cavity liquid inlet pipe is communicated with the buffer chamber, and the spraying cavity liquid outlet pipe is communicated with the spray chamber; the array nozzles are arranged on the spraying hole plate and located at one side of the spraying chamber; a plurality of through holes communicated with the buffer chamber and the array nozzles are formed in the spraying hole plate; the steam cavity and the array nozzle are oppositely arranged, and a phase change working medium is sealed in the steam cavity. The steam cavity and the spraying cavity are integrally connected, the steam cavity can timely and evenly expand high-heat-flow-density heat generated by an electronic element to the spraying surface, the working medium in the spraying cavity is sprayed to the spraying surface at a high speed through the array nozzles, and a large amount of heat is brought away through convection and phase change, thereby achieving the cooling effect on the electronic element.

Description

technical field [0001] The invention belongs to the technical field of spray cooling, and in particular relates to a spray chamber and steam chamber integrated phase change cooling device and system. Background technique [0002] With the continuous improvement of the performance requirements of aerospace electronic components, the degree of integration of electronic packaging is getting higher and higher, and the power consumption per unit volume is increasing. Heat dissipation technology puts forward high requirements. Especially for electronic equipment such as airborne and spaceborne equipment, the heat flux can reach 10 2 up to 10 3 W / cm 2 , the problem of high heat flux heating is becoming more and more serious. In addition, due to the different heating power of each device, the temperature of the electronic equipment is uneven, which reduces the reliability of the equipment operation. At present, there are three main cooling technologies that can meet the heat di...

AI Technical Summary

Problems solved by technology

However, in the process of spray heat exchange, due to the high heat flux density heat source is easy to cause the spray wall to dry up, which limits the heat exchange capacity of spray cooling

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