Surface-mount packaging equipment for semiconductor epitaxial film

Abstract

The invention discloses surface-mount packaging equipment for a semiconductor epitaxial film, which comprises main framework supporting platforms, a packaging execution module and a packaging disc group, wherein the main framework supporting platforms are symmetrically arranged by taking a saddle as the axis, each pneumatic rod is in pneumatic connection with a second connecting rod extending in the horizontal transverse direction, and the packaging execution module is slidably installed on the second connecting rod; and the packaging execution module is an active mechanism module which is used for operating a pasting process between an integrated circuit chip transferred at the upper working section and a packaging substrate or a pin frame. The surface-mount packaging equipment for the semiconductor epitaxial film adopts transistor inner shape grid array packaging, is different from packaging modes such as transistor outer shape packaging and pin grid array packaging, has the advantages of reducing the epitaxial rate of a chip film and reducing the error rate of chip packaging, and adopts a point contact cutting mode of linear cutting to cut off lead feet, pins or redundant upperextending film tissues at one time, so that the destructiveness is low, the cutting speed is higher, and the efficiency is higher.

Description

technical field [0001] The invention relates to semiconductor packaging equipment, in particular to semiconductor epitaxial thin film chip packaging equipment. Background technique [0002] Nowadays, electronic chips are ushering in an era of high development, and the use of microelectronic packaging technology in the field of semiconductor packaging is becoming more and more mature. Replaced by sub-packaging technologies such as PQFN and BGA, on the basis of a large number of three-dimensional packaging, the semiconductor motherboard or each base unit is performing film lamination. Due to the secondary lamination after bonding, cutting is originally performed after film lamination The docile film will spread and extend outward due to extrusion, and it will be baked after the second lamination. At the same time, in order to obtain the best chip placement rate, the back of the IC chip must not only be coated first, but also need to be planted on the carrier. This leads to th...

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Problems solved by technology

[0002] Nowadays, electronic chips are ushering in an era of high development, and the use of microelectronic packaging technology in the field of semiconductor packaging is becoming more and more mature. Replaced by sub-packaging technologies such as PQFN and BGA, on the basis of a large number of three-dimensional packaging, the semiconductor motherboard or each base unit is performing film lamination. Due to the secondary lamination after bonding, cutting is originally performed after film lamination The docile film will spread and extend outward due to extrusion, and it will be baked after the second lamination. At the same time, in order to obtain the best chip placement rate, the back of the IC chip must not only be coated first, but also need to be planted on the carrier. This leads to the difficulty of removing the epitaxial film all the time. When the electroplating pins are formed and cut, the residual film cannot be removed by the ADPE etching technology, which may cause deviations in the positioning of the pins, and the chip is too thick. , Encapsulation is too large, etc. After the pins are formed, the redundant parts of the pins are too large due to the cutting surface, which leads to problems such as flashing and pins flying out.

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