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Wafer and manufacturing method thereof

A manufacturing method and wafer technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., can solve problems such as unfavorable pressing operations, bending, uneven height of metal bumps, etc., to reduce the risk of bending , Improve the effect of surface flatness and height uniformity

Inactive Publication Date: 2019-10-15
厦门通富微电子有限公司
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Problems solved by technology

[0003] However, due to the structural setting of the wafer itself and the influence of uncontrollable factors in the manufacturing process, the surface of the formed metal bumps is often not smooth enough, and the heights of different metal bumps are not uniform, which is not conducive to subsequent processing. Pressing operation, and in the case of relatively slender metal bumps, it is easy to be bent by external force

Method used

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  • Wafer and manufacturing method thereof
  • Wafer and manufacturing method thereof
  • Wafer and manufacturing method thereof

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0025] Please also refer to Figure 1 to Figure 11 , figure 1 It is a schematic flow diagram of an embodiment of the method for manufacturing a wafer of the present application, Figure 2 to Figure 11 It is a structural schematic diagram of an embodiment of the wafer manufacturing method of the present application, and the method includes:

[0026] Step S10: providing a wafer 11 with a plurality of metal bumps 20 arranged at intervals;

[0027] Wherein, the...

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Abstract

The invention discloses a wafer and a manufacturing method thereof. The manufacturing method comprises the steps of: providing a wafer provided with a plurality of metal bumps at intervals; coating glue on the wafer provided with the plurality of metal bumps at intervals to form a protective layer for coating the plurality of metal bumps; and grinding the protective layer and the metal bumps to expose each metal bump out of the protective layer, wherein the height of each metal bump is in a preset range, and the flatness of the surface of one side of each metal bump far away from the wafer isnot lower than a preset flatness. In this way, the surface evenness of the metal bumps can be improved, the heights of different metal bumps are uniform, and the risk that the metal bumps are bent dueto external force can be reduced.

Description

technical field [0001] The present application relates to the technical field of semiconductors, in particular to a wafer and a manufacturing method thereof. Background technique [0002] In the semiconductor industry, during the wafer manufacturing process, it is usually necessary to form metal bumps on the barrier layer to further connect with chips. [0003] However, due to the structural setting of the wafer itself and the influence of uncontrollable factors in the manufacturing process, the surface of the formed metal bumps is often not smooth enough, and the heights of different metal bumps are not uniform, which is not conducive to subsequent processing. Pressing operation, and in the case of relatively slender metal bumps, it is easy to be bent by external force. Contents of the invention [0004] The technical problem mainly solved by this application is to provide a wafer and its manufacturing method, which can improve the surface flatness of metal bumps, make t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/488
CPCH01L21/4814H01L24/11H01L2224/111H01L2224/11
Inventor 简永幸
Owner 厦门通富微电子有限公司
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