PCB ultrasonic wave silver melting tank and silver melting method thereof

Abstract

The invention discloses a PCB ultrasonic wave silver melting tank. The PCB ultrasonic wave silver melting tank comprises a silver melting tank body, wherein a row of rollers are arranged in the silvermelting tank body, and a plurality of water knives are arranged on the silver melting tank body at the positions of two sides of the rollers; the silver melting tank body is internally provided witha plurality of ultrasonic generators, the ultrasonic generators are positioned on two sides of the rollers, the ultrasonic generators are connected with an ultrasonic host through signal wires, and the ultrasonic host is connected with the main control panel through a lead. By utilizing the cooperation of the ultrasonic waves and the water knives, liquid medicine can effectually penetrate slight gaps and apertures on the PCB to perform effective chemical reaction and perform heavy silver operation so as to effectively reduce and improve the Galvanic effect and improve the quality of PCB.

Description

technical field [0001] The invention relates to the technical field of circuit board printing, in particular to an ultrasonic silvering groove for a PCB board and a silvering method thereof. Background technique [0002] The Giavanni effect refers to the phenomenon that due to the potential difference between two metals, electrons pass through the medium to generate current, and then an electrochemical reaction occurs, resulting in the oxidation of the anode with high potential. [0003] In the PCB immersion silver operation, the standard electrode potential of silver is 0.799V, and the standard electrode potential of copper is 0.344V. During the chemical immersion silver process, silver ions are oxidized into metallic silver, metallic copper loses electrons and becomes copper ions, and metallic silver The complexing agent is deposited on the bare copper surface, but there is a gap between the solder mask and the silver copper surface due to the combination of the solder mas...

AI Technical Summary

Problems solved by technology

[0005] (1) Poor perforation ability of potion in the small hole of PCB board and flow capacity of thin seam, it is easy to cause the junction of copper and solder mask at the position of thin seam and micro hole, blind hole, solder mask half plug hole to be unable to sink Shangyin;

[0006] (2) The liquid circulation cannot be circulated to the place, which will produce Giavani effect. If the corrosion is serious, the setting will lead to the failure of the product open circuit, resulting in batch scrapping, resulting in economic losses

Images