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Curable resin composition, prepreg, cured product, laminate, and build-up film

A hardening resin and composition technology, applied in the direction of synthetic resin layered products, layered products, metal layered products, etc., can solve the problems of high dielectric loss, no research, low heat resistance, etc., to achieve Effects of low dielectric loss tangent, high glass transition temperature, and low thermal expansion

Inactive Publication Date: 2019-10-11
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the phosphorus element-containing epoxy resin of Patent Document 1 can impart flame retardancy to the cured product without impairing mechanical properties, but has a problem of high dielectric loss tangent.
In addition, the vinylbenzyl compound described in Patent Document 2 has one unsaturated group in its structure, so its heat resistance is low
Furthermore, Patent Document 3 discloses a polyfunctional phosphorus-containing vinylbenzyl compound and a resin composition, but no studies have been conducted on the specific characteristics of the combination of the phosphorus compound and a specific radically polymerizable resin.

Method used

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  • Curable resin composition, prepreg, cured product, laminate, and build-up film
  • Curable resin composition, prepreg, cured product, laminate, and build-up film
  • Curable resin composition, prepreg, cured product, laminate, and build-up film

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Experimental program
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Effect test

Embodiment 1～ Embodiment 6、 comparative example 1～ comparative example 5

[0161] About Example 1-Example 6 and Comparative Example 1-Comparative Example 5, the resin varnish which has the composition shown in Table 1 was prepared. In Table 1, the compounded amount is % by weight except for the initiator (phr), and the phosphorus content rate is % by weight with respect to the total amount of (A) component and (B) component.

[0162] The resin varnish was impregnated with glass cloth (7628 type manufactured by Nittobo; H258), and dried by heating at 130° C. for 5 minutes to obtain a prepreg.

[0163] The obtained 8 prepregs were stacked up and down with copper foil (manufactured by Mitsui Metal Mining Co., Ltd., 3EC-III, thickness 35 μm), and vacuum pressed at 2 MPa under the temperature conditions of 130°C x 15 minutes + 190°C x 80 minutes, A 1.6 mm thick laminate was obtained. Table 1 shows the results of the glass transition temperature and flame retardancy of the laminate.

[0164] Then, the obtained prepreg was pulverized, and a 100-mesh powde...

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Abstract

Provided are a curable resin composition, a prepreg, a cured product, a laminate, and a build-up film which exhibit halogen-free flame retardancy despite being high in heat resistance and low in dielectric loss tangent. The curable resin composition contains: component (A): a radically polymerizable resin which has a plurality of reactive unsaturated groups in the molecule and in which the functional group concentration of the unsaturated groups is 0.0010 mol / g to 0.0070 mol / g; component (B): a vinyl benzyl compound having a reactive functional group concentration of 0.0020 mol / g-0. 0050 mol / g; and component (C): an initiator. The curable resin composition is characterized in that the phosphorus content in the component (B) is 1.0%-4.5% relative to the total of the component (A) and the component B.

Description

technical field [0001] The present invention relates to a curable resin combination exhibiting excellent flame retardancy, high glass transition temperature, low thermal expansion coefficient, low dielectric loss tangent, low water absorption and excellent solvent solubility in its cured product products, cured products thereof, and prepregs, laminates, and build-up films using the curable resin composition. Background technique [0002] In the technical field of electronic components used in computers or information equipment terminals, especially in the technical field of multilayer printed circuit boards, in recent years, the speed and frequency of signals in various electronic equipment have increased, and the transmission loss of electrical signals has become problem, and requires a material with a low dielectric loss tangent for the insulating layer. [0003] In addition, in the use of these electronic parts, it is necessary to impart flame retardancy, and halogen-bas...

Claims

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Application Information

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IPC IPC(8): C08F257/02C08F230/02C08F212/08C08F212/36C08F212/12B32B17/02B32B17/12B32B15/20B32B15/14
CPCC08F257/02C08F212/08B32B17/02B32B17/067B32B15/20B32B15/14B32B2260/021B32B2260/046B32B2307/3065B32B2307/206B32B2457/04B32B2457/08B32B2262/101C08F230/02C08F212/36C08F212/12C08J5/24B32B27/30
Inventor 和佐野次俊石原一男川辺正直岩下新一
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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