Superjunction IGBT with cutoff reverse conduction field and manufacturing method thereof
A technology of reverse conduction and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as low power density and large IGBT saturation voltage drop, and achieve the effect of reducing production costs.
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[0032] The present invention will be further described below in combination with specific embodiments.
[0033] This embodiment provides an insulated gate bipolar transistor. In the structure of the insulated gate bipolar transistor, a second semiconductor material is injected into the first semiconductor substrate to form a reverse conduction structure;
[0034] A field stop layer and a second epitaxial layer of semiconductor material with a low doping concentration are sequentially stacked on the upper surface of the first semiconductor substrate;
[0035] The epitaxial layer of the second semiconductor material with low doping concentration is implanted with the same concentration of the first semiconductor material and the second semiconductor material, and the first semiconductor material and the second semiconductor material are alternately formed multiple times along the plane where the epitaxial layer is located superjunction structure. Combining the advantages of sup...
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