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Superjunction IGBT with cutoff reverse conduction field and manufacturing method thereof

A technology of reverse conduction and manufacturing method, which is applied in semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., can solve problems such as low power density and large IGBT saturation voltage drop, and achieve the effect of reducing production costs.

Inactive Publication Date: 2019-09-20
厦门芯达茂微电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the saturation voltage drop of IGBTs on the market is relatively large and the power density is low. In the application process, a reverse conduction diode needs to be connected in parallel.

Method used

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Examples

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Effect test

Embodiment Construction

[0032] The present invention will be further described below in combination with specific embodiments.

[0033] This embodiment provides an insulated gate bipolar transistor. In the structure of the insulated gate bipolar transistor, a second semiconductor material is injected into the first semiconductor substrate to form a reverse conduction structure;

[0034] A field stop layer and a second epitaxial layer of semiconductor material with a low doping concentration are sequentially stacked on the upper surface of the first semiconductor substrate;

[0035] The epitaxial layer of the second semiconductor material with low doping concentration is implanted with the same concentration of the first semiconductor material and the second semiconductor material, and the first semiconductor material and the second semiconductor material are alternately formed multiple times along the plane where the epitaxial layer is located superjunction structure. Combining the advantages of sup...

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PUM

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Abstract

The invention provides a superjunction IGBT with a cutoff reverse conduction field. A second semiconductor material is implanted in a first semiconductor substrate to form a reverse conducting structure with the first semiconductor substrate. A field stopping layer and a second semiconductor material epitaxial layer with a low doping concentration are successively stacked on the upper surface of the first semiconductor substrate. A first semiconductor material and a second semiconductor material having the same concentration are implanted in the second semiconductor material epitaxial layer with the low doping concentration. The first semiconductor material and the second semiconductor material alternately form a superjunction structure multiple times along a plane wherein the epitaxial layer is located. The invention also provides a method for manufacturing the IGBT. The superjunction IGBT with a cutoff reverse conduction field and its manufacturing method can effectively reduce the saturation voltage drop of the IGBT and obtain high power density, can make the IGBT thinner and smaller, integrate a reverse conducting diode, and reduce manufacturing cost.

Description

technical field [0001] The present invention relates to transistors, and more particularly to insulated gate bipolar transistors. Background technique [0002] IGBT (Insulated Gate Bipolar Transistor) is a composite fully-controlled-voltage-driven-power semiconductor device composed of BJT (Bipolar Junction Transistor) and MOS (Insulated Gate Field Effect K-tube), with MOSFET The advantages of high input impedance and low conduction voltage drop of BJT. It is widely used in DC 600V and above conversion systems such as AC motors, inverters, lighting circuits, and traction drives. [0003] The IGBT is essentially a field effect transistor, which is very close to the Power MOSFET in terms of structure, and a P+ layer is added to the drain electrode on the back. In this way, a forward-biased PN junction is formed at the drain end, which does not affect conduction but increases the hole injection effect. Its characteristics are similar to BJT with two types of carriers particip...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/331H01L29/06H01L29/739
CPCH01L29/66333H01L29/7398H01L29/0684
Inventor 徐守一赖银坤蔡铭进
Owner 厦门芯达茂微电子有限公司
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