A kind of bio-based high rigidity furan epoxy resin and preparation method thereof

A technology of furan epoxy resin and high stiffness, which is applied in the field of bio-based high stiffness furan epoxy resin and its preparation, can solve the problems of low storage modulus and low stiffness, and achieve high biological safety, efficient utilization, and strong substitution effect

Active Publication Date: 2020-06-12
NANJING TECH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The storage modulus of existing bio-epoxy resin materials prepared based on biological raw materials, that is, the stiffness is generally small, and the reported literature shows that the storage modulus of bio-based epoxy resin polymers is less than 3.0GPa, for example Documents Polymer International, 2018, 67(9), 1194-1202; Green Chemistry, 2017, 19(21), 5236-5242 and ACS Sustainable Chemistry & Engineering, 2018, 6(11), 14812-14819, etc. respectively introduced eugenol Synthesis of bio-like epoxy resins and lignin-based epoxy resins with low storage modulus of the corresponding polymers

Method used

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  • A kind of bio-based high rigidity furan epoxy resin and preparation method thereof
  • A kind of bio-based high rigidity furan epoxy resin and preparation method thereof
  • A kind of bio-based high rigidity furan epoxy resin and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Weigh furan epoxy resin DGF (2.68g, 10mmol) in the reaction bottle, pass into nitrogen, after removing the oxygen component, under nitrogen atmosphere, add 4,4'-diaminodiphenyl sulfone (44DDS, 1.2g, 5mmol ) to further remove the air, fully mix and stir, and heat up to 130°C to melt the two and mix evenly. The materials were uniformly poured into a stainless steel mold plate, and the mold plate was moved into a nitrogen curing box at 185°C. After curing for 3 hours, it was naturally cooled under a nitrogen atmosphere to obtain a yellow opaque epoxy resin polymer (crosslinking density: 1.30mol / dm 3 ). The experimental results of dynamic thermomechanical analysis show that the storage modulus (stiffness) of the obtained material at 0 °C is 2.7 GPa ( Figure 5 ), the phase transition temperature is 176°C. The DSC spectrogram, SEM spectrogram and DTG spectrogram of gained material see figure 2 , image 3 , Figure 4 .

Embodiment 2

[0049] Weigh furan epoxy resin DGF (2.68g, 10mmol) in the reaction bottle, feed nitrogen, remove the oxygen component, under nitrogen atmosphere, add 4,4'-diaminodiphenyl sulfone (44DDS, 1.1g, 4.58 mmol) was further removed from the air, fully mixed and stirred, and heated to 130°C to allow the two to melt and mix uniformly. The materials were evenly poured into a stainless steel mold plate, and the mold plate was moved into a nitrogen curing box at 185°C. After curing for 3 hours, it was naturally cooled under a nitrogen atmosphere to obtain a yellow opaque epoxy resin polymer (crosslinking density: 1.13mol / dm 3 ). The experimental results of dynamic thermomechanical analysis show that the storage modulus (rigidity) of the obtained material at 0°C is 2.53GPa, and the phase transition temperature is 161°C.

Embodiment 3

[0051] Weigh furan epoxy resin DGF (2.68g, 10mmol) in the reaction flask, pass into nitrogen, after removing the oxygen component, under nitrogen atmosphere, add 3,3'-diaminodiphenyl sulfone (33DDS, 1.2g, 5mmol ) to further remove the air, fully mix and stir, and raise the temperature to 150°C to melt and mix them evenly. The material was uniformly poured into a stainless steel mold plate, and the mold plate was moved into a nitrogen curing box at 190°C. After curing for 3 hours, it was naturally cooled under a nitrogen atmosphere to obtain a yellow transparent epoxy resin polymer (crosslinking density: 2.48mol / dm 3 ). The experimental results of dynamic thermomechanical analysis show that the storage modulus (stiffness) of the obtained material at 0 °C is 4.1 GPa ( Figure 5 ), the phase transition temperature is 215°C. The DSC spectrogram, SEM spectrogram and DTG spectrogram of gained material see figure 2 , image 3 , Figure 4 .

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Abstract

The invention discloses biology-based high-rigidity furan epoxy resin and a preparation method thereof, and belongs to the technical field of polymer compounds. The preparation method comprises the following concrete steps: subjecting an obtained furan epoxy resin monomer and different types of curing agents to hot melting, then carrying out uniform mixing, and carrying out mold injection, heating and curing so as to obtain furan epoxy resin with excellent energy storage performance, wherein the furan epoxy resin reaches a phase transition temperature up to 216 DEG C and a rigidity up to 4.1 GPa. The method provided by the invention has the following advantages: through direct adoption of a bulk curing method, simple operation flow and short curing time are achieved, and an obtained biological epoxy resin polymer material has excellent performance.

Description

technical field [0001] The invention belongs to the technical field of polymer compounds, and in particular relates to a bio-based high-rigidity furan epoxy resin and a preparation method thereof. Background technique [0002] Epoxy resin polymers are usually cross-linked and polymerized by epoxy resin monomer materials and curing agents, and are widely used in coatings, adhesives, and electronic and electrical industries, multi-component composite materials, and engineering technology research fields. At present, the main source of epoxy resin is petroleum-based. Especially in recent years, due to the emergence of a series of problems such as environment and resource scarcity, the development of bio-based materials has become an important development path to reduce carbon dioxide industrial emissions and improve the level of green chemical industry. In general, the development of bio-based epoxy resins is mainly based on vegetable oil, lignin, eugenol, itaconic acid and fur...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G59/26C08G59/50
CPCC08G59/26C08G59/504
Inventor 郭凯孟晶晶曾禹舜方正欧阳平凯
Owner NANJING TECH UNIV
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