Automatic chip mounting mechanism

Abstract

The present invention discloses an automatic chip mounting mechanism. The mechanism comprises a feeding device, a plurality of tin-soldering devices matched with the feeding device, and a chip mounting device. A material ejection component comprises a top plate arranged at the lower portion of a conveyer belt and used for extending and top connection with a product carrier to break away the product carrier from the conveyer belt, a material blocking component comprises a blocking post extended to the side of the product carrier to limit the movement of the product carrier along the conveyer belt, each tin-soldering device comprises a plurality of tin-soldering needle tips horizontally and vertically moving arranged at the upper portion of the product carrier, the chip mounting device comprises a material taking component configured to convey a chip, a rotation component configured to rotate and locate the chip and an attaching component, the material taking component comprises a lifting material taking sucking disc, the rotation component comprises a rotationally arranged rotation platform, the material taking sucking disc sucks the chip to be located at the rotation platform, andthe attaching component comprises an attaching sucking disc configured to absorb the chip on the rotation platform in a lifting movement mode and transmit the chip onto the product carrier in the conveyer belt. The automatic chip mounting mechanism achieves automatic product feeding and chip mounting, and improves the processing efficiency.

Description

technical field [0001] The invention belongs to the technical field of circuit board manufacturing, and in particular relates to an automatic patch mechanism. Background technique [0002] In the process of circuit board manufacturing, it is necessary to perform tin spotting and pasting chip operations inside. The traditional tin spotting and chip pasting operations are divided into multiple stations. The products must be positioned one by one and tinned one by one. If the positioning process products Movement, resulting in dislocation of tin points, resulting in product quality problems; in the placement operation, it is necessary to first rotate the angle of the chip, and then align it with the angle of the product to attach it. The robot directly picks up and rotates the operation, which is easy to make the positioning of the product deviate, and The way of clamping and positioning one by one has low work efficiency, and the linkage equipment involved in the manipulator i...

AI Technical Summary

Problems solved by technology

[0002] In the process of circuit board manufacturing, it is necessary to perform tin spotting and pasting chip operations inside. The traditional tin spotting and chip pasting operations are divided into multiple stations. The products must be positioned one by one and tinned one by one. If the positioning process products Movement, resulting in dislocation of tin points, resulting in product quality problems; in the placement operation, it is necessary to first rotate the angle of the chip, and then align it with the angle of the product to attach it. The robot directly picks up and rotates the operation, which is easy to make the positioning of the product deviate, and The method of clamping and positioning one by one has low work efficiency, and the linkage equipment involved in the manipulator is more complicated and the cost is high

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