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Organosilicon pressure-sensitive adhesive and preparation method thereof

A technology of silicone pressure-sensitive adhesives and pressure-sensitive adhesives, which is applied in the direction of pressure-sensitive films/sheets, adhesives, and adhesive additives. Excellent boiling resistance, excellent cohesive strength, and low peel strength

Inactive Publication Date: 2019-08-23
昆山普瑞凯纳米技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Different electronic products, different display substrates and different uses have different performance requirements for silicone pressure-sensitive adhesives. The current silicone pressure-sensitive adhesives have made great progress in the technology of high peeling force. The peeling force can reach about 1800g / 25mm, but there is still no large-scale product available for silicone pressure-sensitive adhesives that achieve stable low peeling force, especially the ultra-low peeling force of 180° peeling force <0.8g

Method used

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  • Organosilicon pressure-sensitive adhesive and preparation method thereof
  • Organosilicon pressure-sensitive adhesive and preparation method thereof

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preparation example Construction

[0033] The preparation method of the gum base component comprises the following steps: adding vinyl polysiloxane with a molecular weight of 500,000 to 700,000 and vinyl polysiloxane with a molecular weight of 5,000 to 20,000 into a reaction kettle, and then adding The diluent is put into the reaction kettle and the vinyl polysiloxane is fully dissolved and dispersed, and then 0.1-2% of the total amount of vinyl polysiloxane is added to the reaction kettle. React in the reactor for 2 to 6 hours under the same conditions, and then distill to remove water, add 0.04 to 0.4 parts of inhibitor in the reactor, and stir evenly; it also includes independent components, and the independent components include base rubber in parts by weight The component is 100 parts, the catalyst component is 0.5-2 parts, the cross-linking agent component is 0.5-2 parts, and the adhesive component is 0.5-1.5 parts.

[0034] The catalyst component is a platinum metal catalyst with a platinum content of 20...

Embodiment 1

[0052] 1) Preparation of base rubber components:

[0053] Add 80 parts of Vinyl Dimethicone A with a vinyl content of 0.2% and 20 parts of Vinyl Dimethicone B with a vinyl content of 0.6% to the reactor, and then add 120 parts of Diluent, stirring, to fully dissolve and disperse vinyl polysiloxane, add 0.1% of the total amount of vinyl polysiloxane basic catalyst, react at 60-80°C for 6 hours under the condition of nitrogen protection, and then heat up When the solvent boils, distill out the reacted water, cool down, add 0.04 part of inhibitor, stir evenly, that is the base rubber component.

[0054] 2) Preparation of pressure sensitive adhesive:

[0055] Add 150 parts of diluent to 100 parts of base glue, and stir evenly; then slowly add 2 parts of crosslinking agent, 1.5 parts of anchoring agent and 2 parts of catalyst under the condition of stirring, and stir for 5-10 minutes after all the addition is complete. Glue preparation is complete.

[0056] 3) Curing of pressure...

Embodiment 2

[0060] 1) Preparation of base rubber components:

[0061] Add 60 parts of Vinyl Dimethicone A with a vinyl content of 0.6% and 20 parts of Vinyl Dimethicone B with a vinyl content of 2.0% to the reactor, and then add 60 parts of Diluent, stirring, to fully dissolve and disperse vinyl polysiloxane, then add 2% of the total amount of vinyl polysiloxane basic catalyst, react for 3 hours at 60-80°C under nitrogen protection, and then Raise the temperature until the solvent boils, distill out the reacted water, cool, add 0.4 part of inhibitor, stir evenly, that is the base rubber component.

[0062] 2) Preparation of pressure sensitive adhesive:

[0063] Add 50 to 150 parts of diluent to 100 parts of base glue, and stir evenly; then slowly add 0.5 parts of crosslinking agent, 1.5 parts of anchoring agent and 2 parts of catalyst under stirring conditions, and stir for 5 to 10 minutes after all additions are completed. The pressure sensitive adhesive is prepared.

[0064] 3) Curin...

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Abstract

The invention discloses an organosilicon pressure-sensitive adhesive, and a preparation method thereof, and belongs to the technical field of organosilicon pressure-sensitive adhesive material, and especially relates to an organosilicon pressure-sensitive adhesive extremely low in peel strength and a preparation thereof. The organosilicon pressure-sensitive adhesive is prepared from two vinyl polysiloxanes of different molecular weights, so that the organosilicon pressure-sensitive adhesive is provided with excellent levelability, and operationality; vinyl content and hydroxyl content are controlled, so that the organosilicon pressure-sensitive adhesive is provided with extremely low peel strength; an anchoring agent capable of taking part in crosslinking is selected, so that the bonding force of the organosilicon pressure-sensitive adhesive with PET base material is increased, and no degumming or picking is caused after 4h of water boiling. The organosilicon pressure-sensitive adhesive can be widely used in fields such as pressure-sensitive adhesive tape, electronic product protective film, or isolated film with requirements on low peel strength.

Description

technical field [0001] The invention relates to the technical field of silicone pressure-sensitive materials, in particular to a silicone pressure-sensitive adhesive with ultra-low peeling strength and a preparation method thereof. Background technique [0002] Silicone pressure-sensitive adhesive is a new type of adhesive with broad development prospects. It not only has the pressure sensitivity necessary for pressure-sensitive adhesives, but also has many properties that other materials are difficult to possess: (1) It has the properties of high-energy and low-energy surface materials. Good adhesion, so it has good adhesion to untreated difficult-to-adhesive materials, such as PTFE, polyimide, polycarbonate, etc.; (2) has outstanding high and low temperature resistance It can be used for a long time between -50 and 200 ° C, and still maintains its bonding strength and flexibility at high and low temperatures; (3) has good chemical inertness, long service life, and outstand...

Claims

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Application Information

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IPC IPC(8): C09J183/07C09J11/08
CPCC08L2205/025C09J11/08C09J183/04C09J2467/006C09J7/38C08L83/04
Inventor 刘坤罗文豪谢林峰
Owner 昆山普瑞凯纳米技术有限公司
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