Thermal interface composite material, and preparation method and application thereof

Abstract

The invention provides a thermal interface composite material, and a preparation method and an application thereof. The thermal interface composite material comprises a carbon fiber skeleton, and a polymer matrix for filling and coating the carbon fiber skeleton; and carbon fibers in the carbon fiber skeleton are arranged along a unidirectional manner. The directionally aligned carbon fibers establish a thermal conduction channel in the vertical direction of the thermal interface composite material, and the carbon fibers are mutually contacted and connected in the direction, so the overall interface thermal resistance of the material is reduced, and the out-of-plane thermal conductivity of the thermal interface composite material is greatly improved; and the carbon fiber skeleton and the polymer matrix cooperate with each other, so the thermal interface composite material has a high glass transition temperature and good mechanical properties such as strength and toughness. The thermalinterface composite material provided by the invention has excellent thermal conduction property and excellent mechanical properties, and the preparation method is simple, and is easy to operate, so the material is a novel thermal conduction material with a large-scale industrial production prospect.

Description

Technical field [0001] The invention belongs to the technical field of polymer composite materials, and specifically relates to a thermal interface composite material and a preparation method and application thereof. Background technique [0002] The miniaturization and high integration of electronic components not only endow electronic products with more functions and higher efficiency, but also greatly increase the working power per unit volume in electronic products, which brings about serious heat dissipation problems. The dissipation and heat generation of electronic components will directly lead to an increase in the temperature and thermal stress of electronic equipment, which poses a serious threat to the working reliability of microelectronic equipment. The most important heat dissipation design of electronic components is to rely on thermal interface materials to connect the chip to the substrate and the heat dissipation system of the substrate. The industry generally b...

AI Technical Summary

Problems solved by technology

[0006] However, in the prior art, thermal interface materials based on compound powder-type thermally conductive fillers have problems such as difficult processing and high cost, and materials with a high proportion of compound powder and good thermal conductivity often have reduced mechanical properties, poor toughness, and are not durable Corrosion; the thermal interface material with carbon nanotubes has excellent performance, but the preparation process of carbon nanotubes is complicated and the cost is high, which is not suitable for industrial application; graphene, as a two-dimensional thermal conductivity material, has anisotropic thermal conductivity, so based on Graphene thermal interface materials exhibit good in-plane thermal conductivity, but low out-of-plane thermal conductivity, making it difficult to achieve good out-of-plane heat dissipation performance

Images