Method for connecting N-type Bi2Te3 and Cu electrode based on nano-silver solder paste and nickel plating

A connection method and a technology of nickel coating, which are applied in thermoelectric device components, manufacturing/processing of thermoelectric devices, materials for thermoelectric device junction leads, etc., can solve problems such as inability to meet the temperature requirements of thermoelectric devices and poor reliability of brazed joints , to achieve the effect of avoiding deterioration of joints, good high-temperature mechanical properties, excellent electrical and thermal conductivity

Pending Publication Date: 2019-08-06
HARBIN INST OF TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The present invention will solve the problem of N-type Bi connected by Sn-based solder 2 Te 3 The thermoelectric device connected with the Cu electrode cannot meet the temperature requirements of the thermoelectric device and the reliability of the brazing joint is poor. A method for connecting N-type bismuth telluride and Cu electrodes based on nano-silver solder paste and nickel plating is proposed.

Method used

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  • Method for connecting N-type Bi2Te3 and Cu electrode based on nano-silver solder paste and nickel plating
  • Method for connecting N-type Bi2Te3 and Cu electrode based on nano-silver solder paste and nickel plating
  • Method for connecting N-type Bi2Te3 and Cu electrode based on nano-silver solder paste and nickel plating

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Experimental program
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Embodiment 1

[0037] Embodiment 1: This embodiment is based on the N-type Bi of nano-silver solder paste and nickel coating 2 Te 3 The connection method with the Cu electrode is carried out according to the following steps: first use the electroplating method on the N-type Bi 2 Te 3 Prepare a nickel coating with a thickness of 3 μm as a diffusion barrier layer on the surface to be welded, and then use nano-silver solder paste on the N-type Bi 2 Te 3 The brazing connection between the surface to be welded and the Cu electrode is completed. In this example, N-type Bi 2 Te 3 Nickel plating is prepared on the surface to be welded as a diffusion barrier layer, and the nickel barrier layer can reduce N-type Bi 2 Te 3 Elemental diffusion of Ag, Bi, Te, Se and other elements occurs between the nano-silver, and the nickel barrier layer and the nano-silver are metallurgically bonded without any intermetallic compounds; nano-silver has excellent electrical and thermal conductivity, High-temper...

Embodiment 2

[0048] Embodiment 2: The difference between this embodiment and embodiment 1 is that the N-type Bi 2 Te 3 In Step 2 of the brazing connection process between the surface to be welded and the Cu electrode, put the fixed assembly obtained in Step 1 into a vacuum heating furnace, and adjust the vacuum degree to 1×10 -3 Pa, then start to heat up to 250°C at a rate of 10°C / min, then heat to 260°C at a rate of 5°C / min and hold for 30 minutes, then cool to room temperature with the furnace. Other steps and processing parameter are identical with embodiment 1.

[0049] The room temperature shear strength of the joint obtained in this example is 6MPa, and after 150 hours of service at 250°C, the shear strength is 5MPa, and the joint strength changes only about 10%. The interface of the brazed joint is dense and well bonded.

Embodiment 3

[0050] Embodiment 3: what this embodiment is different from embodiment 1 is, utilizes nano-silver solder paste to N-type Bi 2 Te 3 In Step 2 of the brazing connection process between the surface to be welded and the Cu electrode, put the fixed assembly obtained in Step 1 into a vacuum heating furnace, and adjust the vacuum degree to 1×10 -3 Pa, then start heating to 250°C at a speed of 10°C / min, then heat to 290°C at a speed of 5°C / min and hold for 30 minutes, then cool to room temperature with the furnace. Other steps and processing parameter are identical with embodiment 1.

[0051] The room temperature shear strength of the joint obtained in this example is 7MPa, and after 150 hours of service at 250°C, the shear strength is 6MPa, the joint strength changes little, and the brazed joint has no defects such as cracks, pores, and inclusions.

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Abstract

A method for connecting N-type Bi2Te3 and a Cu electrode based on nano-silver solder paste and nickel plating relates to a method for connecting Bi2Te3 and a Cu electrode. The purpose is to solve theproblem that a thermoelectric device composed of N-type Bi2Te3 and a Cu electrode connected by Sn-based solder cannot meet the service temperature requirement of thermoelectric devices and the reliability of the brazing joint is poor. The method includes the following steps: first, preparing nickel plating as a diffusion barrier layer on a to-be-welded side of N-type Bi2Te3; and then, brazing theto-be-welded side of N-type Bi2Te3 and a Cu electrode with nano-silver solder paste. The effective bonding between the nickel barrier layer and nano-silver and between nano-silver and Cu ensures the reliability of the joint. The shear strength decreases slightly during service, and good service performance is achieved at medium and low temperatures. The method of the invention is suitable for theconnection of N-type Bi2Te3 and a Cu electrode.

Description

technical field [0001] The present invention relates to a Bi 2 Te 3 Connection method with Cu electrode. Background technique [0002] With the continuous increase of human energy demand and the increasing shortage of traditional non-renewable energy stocks, the development of new sustainable energy sources has become an important topic in today's scientific and technological circles. Thermoelectric materials, as a functional material that utilizes the carrier transport phenomenon inside the material to convert heat energy and electric energy, have been highly valued and vigorously researched and developed by various countries. Thermoelectric materials can directly convert the waste heat of industrial production into electrical energy, that is, thermoelectric power generation, and thermoelectric power generation has broad application prospects. Bismuth telluride (Bi 2 Te 3 ) is the thermoelectric material with the best performance at room temperature, and has been exten...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/10H01L35/16H01L35/34
CPCH10N10/82H10N10/852H10N10/01
Inventor 张丽霞卜静冬耿慧远孙湛刘显鹏
Owner HARBIN INST OF TECH
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