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Power electronics module and a method of producing a power electronics module

A power electronic module, power electronic technology, applied in the direction of printed circuit manufacturing, circuits, electrical components, etc., can solve the problems of foil layer rupture, grease or paste material pumping, etc., to achieve increased heat transfer capacity, simple installation Effect

Active Publication Date: 2019-08-06
ABB (SCHWEIZ) AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Another problem with conventional thermal interface material layers is that when the power electronics module is twisted and bent during use, the foil-like layer may crack and grease or pasty material may pump out

Method used

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  • Power electronics module and a method of producing a power electronics module
  • Power electronics module and a method of producing a power electronics module
  • Power electronics module and a method of producing a power electronics module

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Embodiment Construction

[0038] figure 2 A cross-section of a power electronics module according to an embodiment of the invention is shown. figure 2 The cross-section of FIG. 1 shows power semiconductor chips 11 , 12 soldered to a substrate such as a DBC structure 3 , 4 . According to the invention, a power electronics module comprises a plurality of power electronics semiconductor chips incorporated into a housing and attached to a substrate. In the description and drawings, specific reference is made to a direct bonded copper structure as an example of a substrate. figure 2 The section of FIG. 1 shows only two semiconductor chips 11 , 12 . However, the number of chips is not limited to any specific number.

[0039] The power electronics module also includes a heat transfer structure attached to the substrate and having a bottom surface forming an outer surface of the module and adapted to receive a surface of the cooling device. It is well known that heat from semiconductor chips is usually ...

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Abstract

The invention discloses a power electronics module and a method of producing a power electronics module. The power electronics module comprising multiple of power electronic semiconductor chips incorporated in a housing and attached to a substrate, and a heat transfer structure attached to the substrate and having a bottom surface which forms an outer surface of the module and which is adapted toreceive a surface of a cooling device, wherein the heat transfer structure comprises a compressible base plate.

Description

technical field [0001] The present invention relates to power electronics modules, and in particular to power electronics modules with improved cooling performance. Background technique [0002] Power electronics modules are commonly used in high power devices for switching high currents and operating on high voltages. A power electronics module contains several switching components located in the same component housing and usually interconnected to each other to provide some kind of circuit structure. [0003] Power electronics modules are used, for example, to manufacture certain power conversion circuits, such as inverters and converters. An example of a power electronics module includes two IGBTs (Insulated Gate Bipolar Transistors) connected in series inside the module. Other examples may include bridge topologies or parts of bridge topologies that are easily electrically connected inside the module. [0004] A power electronics module may also include a base plate, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/14H01L23/373
CPCH01L23/14H01L23/373H01L23/42H01L23/433H01L23/3735H05K1/0203H05K3/341H05K3/0061
Inventor 约尔马·曼尼宁米卡·西尔文诺伊宁约尼·帕卡里宁谢尔·英曼
Owner ABB (SCHWEIZ) AG
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