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Cooling components and electronic equipment

A technology for heat dissipation components and electronic equipment, applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems of poor level consistency and poor heat dissipation effect, and achieve the effect of small thermal resistance coefficient, prevention of electromagnetic interference, and flexible internal structure layout

Active Publication Date: 2015-12-16
KUANG CHI INST OF ADVANCED TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the poor consistency of the components when they are assembled and soldered, the heat dissipation effect is not good.

Method used

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  • Cooling components and electronic equipment
  • Cooling components and electronic equipment
  • Cooling components and electronic equipment

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] see figure 1 , is a perspective view of the heat dissipation component in the electronic device of the present invention. The electronic device includes a heat dissipation component 10 . The heat dissipation assembly 10 is applied in electronic equipment including but not limited to various consumer electronic equipment, servers, radio frequency equipment, electronic communication equipment and LED lamps.

[0020] Please also refer to figure 2 , the heat dissipation assembly 10 includes a protective cover 11 and a heat dissipation unit 12 interlocked with the protective cover 11 . The protective cover 11 and the heat dissipation unit 12 are interlocked to form a cavity 9 for accommodating a PCB board 13 (such as image 3 shown). The heat dissipation unit 12 is provided with a first clamping portion 123 and a second clamping portion 124 , and the first clamping portion 123 and the second clamping portion 124 are both formed by a pair of grooves. The first engaging ...

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PUM

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Abstract

The invention discloses a radiation component, which comprises a protective cover and a radiation unit. The radiation unit comprises a plate-like pedestal, and a first clamping part, a second clamping part and fins, which are arranged on the plate-like pedestal. The first and second clamping parts and the fins are arranged on the two opposite surfaces of the plate-like pedestal respectively. A pair of clamping hooks are formed on the protective cover, and are clamped in the first clamping part to buckle the protective cover and the radiation unit to form a cavity. The second clamping part is used for fixing a printed circuit board in the cavity. Heat produced by high-heat devices on the PCB is quickly conducted to the radiation component through the directional heat conduction PCB, and is externally dissipated, so that the temperature of the whole PCB is substantially kept consistent. The invention also provides electronic equipment with the radiation component.

Description

technical field [0001] The invention relates to the field of heat dissipation of electronic equipment, in particular to a heat dissipation assembly for a PCB board and electronic equipment using the heat dissipation assembly. Background technique [0002] At present, when there are a few devices on the PCB that generate a lot of heat, a radiator or heat pipe can be added to the heating device. If the temperature cannot be lowered, a radiator with a fan can be used to enhance the heat dissipation effect. When there are many heat-generating components on the PCB, a large heat dissipation cover can be used. It is a special radiator customized according to the position and height of the heat-generating components on the PCB, or a different radiator can be cut out on a large flat radiator. Component height position. Buckle the cooling cover on the component surface as a whole, and contact each component to dissipate heat. However, due to the poor consistency of the components w...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 刘若鹏徐冠雄吕晶史世东
Owner KUANG CHI INST OF ADVANCED TECH
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